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Publication


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Archive | 1997

Process for producing a multi-layer wiring board

Katsura Hayashi; Akihiko Nishimoto; Yukihiro Hiramatsu; Yuji Iino; Shuichi Tateno; Riichi Sasamori; Shigeaki Fukumoto


Archive | 2000

Ceramic wiring substrate and method of producing the same

Tetsuya Kimura; Katsuhiko Onitsuka; Katsura Hayashi; Shinya Kawai; Akihiko Nishimoto


Archive | 2002

Film with metal foil

Akihiko Nishimoto; Katsura Hayashi; Yasuhiko Ohyama; Shigeru Danjo; Kazuhiro Shimomura


Archive | 1996

Wiring substrate-forming transfer sheet and manufacture of wiring-substrate using the same

Katsura Hayashi; Koyo Hiramatsu; Akihiko Nishimoto; 幸洋 平松; 昭彦 西本


Archive | 2002

Electrolytic copper foil, film and multilayer wiring substrate therewith, and method of manufacturing the same

Masaaki Hori; Akihiko Nishimoto; Tomohiro Nitao; 智広 仁田尾; 正明 堀; 昭彦 西本


Archive | 1996

Production of silicon carbide sintered compact

Akihiko Nishimoto; Shuichi Tateno; Masaki Terasono; 正喜 寺園; 周一 立野; 昭彦 西本


Archive | 1996

MULTI-LAYER INTERCONNECTION BOARD

Katsura Hayashi; Koyo Hiramatsu; Akihiko Nishimoto; 幸洋 平松; 昭彦 西本


Archive | 1998

Film fitted with metal foil and production of wiring board using the same

Katsura Hayashi; Akihiko Nishimoto; 昭彦 西本


Archive | 2008

Multilayer piezoelectric element and vibrator

Akihiko Nishimoto; Shuhei Tabata; Kenji Yamakawa; 健二 山川; 周平 田畑; 昭彦 西本


Archive | 1996

Transfer sheet for forming wiring board, its manufacture, and manufacture of wiring board

Shigeaki Fukumoto; Katsura Hayashi; Koyo Hiramatsu; Akihiko Nishimoto; 幸洋 平松; 重昭 福元; 昭彦 西本

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