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Toshiro Okamura

Hitachi

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Publication

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Archive | 1989

Process for producing printed wiring board

Hiroshi Takahashi; Shin Takanezawa; Masao Kanno; Toshiro Okamura; Naoki Fukutomi; Hiroyoshi Yokoyama; Hideo Watanabe; Hajime Yamazaki; Hiroyuki Wakamatsu; T. Takahashi

Archive | 1988

Process for treating copper surface

Akishi Nakaso; Toshiro Okamura; Haruo Ogino; Tomoko Watanabe; Yuko Kimura

Archive | 1978

Method of improving adhesion between insulating substrates and metal deposits electrolessly plated thereon, and method of making additive printed circuit boards

Yorio Iwasaki; Toshiro Okamura; Akishi Nakaso; Nobuo Uozu; Hiroshi Takahashi

Archive | 1985

Process for treating metal surface

Akishi Nakaso; Youichi Kaneko; Toshiro Okamura; Kiyoshi Yamanoi

Archive | 1987

Process for metallizing glass surface

Hajime Nakayama; Kouichi Tsuyama; Toshiro Okamura

Archive | 1983

Electroless copper deposition solution

Akishi Nakaso; Kiyoshi Yamanoi; Toshiro Okamura; Yoshiyuki Tsuru

Archive | 1993

Process for producing coaxial conductor interconnection wiring board

Yorio Iwasaki; Toshiro Okamura; Shigeharu Arike; Yasushi Shimada; Hiroharu Kamiyama; Eisaku Namai; Fujio Kojima

Archive | 1991

Coaxial conductor interconnection wiring board

Yorio Iwasaki; Toshiro Okamura; Shigeharu Arike; Yasushi Shimada; Hiroharu Kamiyama; Eisaku Namai; Fujio Kojima

Archive | 1994

Multiple wire adhesive on a multiple wire wiring board

Shigeharu Arike; Yorio Iwasaki; Eiichi Shinada; Toshiro Okamura; Kanji Murakami; Yuichi Nakazato

Archive | 1993

Adhesive of epoxy resins, epoxy-modified polybutadiene and photoinitiator

Shigeharu Arike; Yorio Iwasaki; Eiichi Shinada; Toshiro Okamura; Kanji Murakami; Yuichi Nakazato

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Yorio Iwasaki

Hitachi

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Hiroshi Takahashi

Hitachi

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Akishi Nakaso

Hitachi

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Hiroyoshi Yokoyama

Hitachi

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Shin Takanezawa

Hitachi

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Masao Kanno

Hitachi

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Shigeharu Arike

Hitachi

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Fujio Kojima

Hitachi

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Hajime Nakayama

Hitachi

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Hajime Yamazaki

Hitachi

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