Alexander H. Nickel

Semiconductor device with copper-filled via includes a copper-zinc/alloy film for reduced electromigration of copper

Method of reducing electromigration in a copper line by Zinc-Doping of a copper surface from an electroplated copper-zinc alloy thin film and a semiconductor device thereby formed

Cu annealing for improved data retention in flash memory devices

Method of reducing electromigration in a copper line by electroplating an interim copper-zinc alloy thin film on a copper surface and a semiconductor device thereby formed

Conformal liner for gap-filling

Low defect organic BARC coating in a semiconductor structure

Gap-filling with uniform properties

Semiconductor device having copper lines with reduced electromigration using an electroplated interim copper-zinc alloy film on a copper surface

Method of reducing electromigration by forming an electroplated copper-zinc interconnect and a semiconductor device thereby formed

Semiconductor devices with copper interconnects and composite silicon nitride capping layers