Andreas Middendorf

Environmental assessments of electronics: a new model to bridge the gap between full life cycle evaluations and product design

In this paper summaries and comparisons of different approaches for the environmental assessment of electronics are presented. A new assessment model developed at the IZM is explained, which is based on the material content of a product instead of the complete life cycle process chain. Comparisons with other simplified indicator systems and with complex life cycle methods such as those according to SETAC or EPS are made. Emphasis is put on the user needs and the data acquisition problems for each approach and on the usability of the results in the design of electronic products.

An environmental comparison of packaging and interconnection technologies

Packaging and interconnection are driving forces behind the miniaturization of electronics. Since miniaturization means less use of resources this trend seems inherently environmentally benign. Adverse effects may overlay this simple truth. The investments for new production facilities rise, the complexity and closeness of non-separable compounds in electronic products increase and the amount and applications of electronic goods multiply. The goal must be to influence new technology developments as early as possible to ensure that the balance of the listed effects remains positive for the environment. As a first step in this direction a simple comparison of different interconnection options is made which is based on the material content of the different printed circuit board assemblies.

Environmental performance of mobile products

Digitalization, miniaturization and integration are strong drivers for further development of products for mobile communication. As such these will generally lead to lower environmental loads per product. However, the strongly increasing number of products on the market will reverse this trend for the total sector. Examinations on telephones have been carried out jointly at Philips Consumer Electronics and at the Fraunhofer Institute for Reliability and Microintegration (IZM). The characteristic product parts, energy supply, display, encasing and electronic signal processing are subjected to an environmental assessment (including environmental assessment with Eco-Indicator and with the Toxic Potential Indicator IZM-TPI) and improvement potentials are shown for the selected products. The analysis shows that in mobile products, energy systems and the printed circuit boards are the key elements in further reduction of environmental loads. Both alternative substrates, lead free soldering and component selection (less hazardous substances) can contribute substantially towards this goal. These three topics are combined with further miniaturization, especially reduction of the board size, in the future. Approximately only half of the potential in this field has been implemented yet. As an overall result, it is concluded that the environmentally based load of present and future mobile products can be kept within limits if a swift implementation of EcoDesign (design for environment) is ensured.

Green MST design from a designer's perspective: how to base decisions on environmental issues

Eco-design is a frequently applied concept, but mostly as a case study or based on a given product, which has to be improved. Rarely design for environment is used as part of the development of a new product, because environmental assessments usually need a sound data basis; see e.g. common life cycle analysis concepts. Hence, this paper presents an integrated approach, how to deal with environmental issues during product design, when knowledge about the later product is still fairly limited - and the possibility to implement major changes is still given. The approach presented focuses on lean and smart measures, which work without additional extensive data acquisition and scenarios. However, they impose uncertainties, but remain applicable for the designer. This approach is shown for one of the most advanced tasks in electronics: Design of micro systems technology (MST) devices, known also as micro electro mechanical systems (MEMS). Furthermore, overlaps with other disciplines, such as microelectronics design is inevitable.

Towards a better closed loop economy for electronic products. Information management between manufacturers and recyclers

Taking into account recycling technologies and the development of electronic products towards further miniaturization and increasing complexity various ways are shown, how by improving the information flow the products last life phase can be made more economically and ecologically efficient. Both centralized and decentralized, product integrated information systems are taken into consideration. In an industrial project scientists at the Fraunhofer Institute for Reliability and Micro-integration (IZM) in Berlin developed the information system IDEE. This system, where international manufacturers and regional recyclers work together, is described in more detail.

Integration of reliability and environmental aspects in early design stages of mechatronics

Mechatronics use the synergies from the interaction of electronics, mechanics and information technology [1]. It covers a wide range of components, interconnection technologies, and application specific software. Mechatronics design is a multi-domain exercise involving concurrent design evaluations and respective decision making in various fields of engineering. Whereas small form factors and the improvement of functionality has been the primary design aim in the past, nowadays a focus is also placed on environmental performance and reliability in order to create a sustainable product. As a matter of fact there are no engineering tools available that integrate these particular aspects adequately in the design process. Most environmental and lifetime assessments are done in the post-design phase. At this late stage however, it becomes difficult and costly to change an existing design. In this paper we describe new requirements for mechatronics design. On the example of a miniature robot we outline the principle methodology for (1) a design process integrated environmental assessment and (2) a sustainable lifecycle concept with focus on reliability. The paper outlines a system of coherent partial models, which are used for the description of the principle design solutions. Along the line of these models we discuss an integrated environmental assessment and reliability approach.

X-free mobile electronics-strategy for sustainable development

Worldwide information exchange and availability, communication without limits will become basic needs of future generations. The information and communication technologies do not only serve for realizations of these aims they also have a high potential to contribute to a sustainable development. Though, there are critical ecological, social, economic and cultural trends which cannot be ignored and which may cause adverse effects on sustainability. In this paper the ecological dimension of sustainability will be particularly considered. The vision of sustainable mobile products should be based on closed product and material loops without emission of pollutants. Important steps for transition from todays to sustainable products are described in this context.