Anh Duong

Aqua Regia and Hydrogen Peroxide HCl Combination to Remove Ni and NiPt Residues

method to etch cu/Ta/TaN selectively using dilute aqueous Hf/h2so4 solution

METHODS FOR ETCHING COPPER DURING THE FABRICATION OF INTEGRATED CIRCUITS

Selective etching of copper and copper-barrier materials by an aqueous base solution with fluoride addition

Process to Etch Ni and Pt Residues during Silicide Contact Electrode Processing Using Low Temperature Aqueous Solutions

Microwave-assisted heating of strong acid solution to remove nickel platinum/platinum residues

PROCESS TO REMOVE Ni AND Pt RESIDUES FOR NiPtSi APPLICATIONS

HIGH PRODUCTIVITY COMBINATORIAL WORKFLOW FOR PHOTORESIST STRIP APPLICATIONS

PROCESS TO REMOVE Ni AND Pt RESIDUES FOR NiPtSi APPLICATIONS USING AQUA REGIA WITH MICROWAVE ASSISTED HEATING

Method for cleaning platinum residues on a semiconductor substrate