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Dive into the research topics where Atsuko Fujino is active.

Publication


Featured researches published by Atsuko Fujino.


Archive | 2006

Heatsink substrate and heat conductive sheet, and power module using these

Atsuko Fujino; Seiki Hiramatsu; Hiromi Ito; Kenji Mimura; Takashi Nishimura; Hironori Shioda; Hideki Takigawa; Toshiyuki Toyoshima; Kei Yamamoto; 研史 三村; 浩美 伊藤; 裕基 塩田; 圭 山本; 星紀 平松; 秀記 瀧川; 敦子 藤野; 隆 西村; 利之 豊島


Archive | 2009

Thermosetting resin composition, thermal conductive resin sheet, manufacturing method thereof and power module

Atsuko Fujino; Koji Hamano; Seiki Hiramatsu; Motoki Masaki; Kenji Mimura; Takashi Nishimura; Kazuhiro Tada; Hideki Takigawa; Kei Yamamoto; 研史 三村; 和弘 多田; 圭 山本; 星紀 平松; 元基 正木; 浩司 濱野; 秀記 瀧川; 敦子 藤野; 隆 西村


Archive | 2002

Mask blank, protective film used therefor, and pattern forming method for mask blank

Atsuko Fujino; Teruhiko Kumada; Kazuyuki Maedoko; 和行 前床; 輝彦 熊田; 敦子 藤野


Archive | 2002

Mask blank, protective film therefor and method of patterning mask blank

Teruhiko Kumada; Atsuko Fujino; Kazuyuki Maetoko


Archive | 1998

Chemically amplifying resist material, photosensitive resin composition and use method of that composition for production of semiconductor device

Atsuko Fujino; Teruhiko Kumada; Atsushi Oshida; 敦史 押田; 輝彦 熊田; 敦子 藤野


Archive | 2007

Heat-conductive resin sheet and power module

Atsuko Fujino; Seiki Hiramatsu; Hiromi Ito; Kenji Mimura; Takashi Nishimura; Hironori Shioda; Hideki Takigawa; Toshiyuki Toyoshima; Kei Yamamoto; 研史 三村; 浩美 伊藤; 裕基 塩田; 圭 山本; 星紀 平松; 秀記 瀧川; 敦子 藤野; 隆 西村; 利之 豊島


Archive | 2001

Developing process, process for forming pattern and process for preparing semiconductor device using same

Atsuko Fujino; Teruhiko Kumada; Atsushi Oshida; Koji Tange; Hitoshi Fukuma


Archive | 2003

FORMING METHOD OF LOW DIELECTRIC CONSTANT FILM

Atsuko Fujino; Teruhiko Kumada; Norihisa Matsumoto; Shigeru Matsuno; Eiji Nobutoki; 英治 信時; 紀久 松本; 繁 松野; 輝彦 熊田; 敦子 藤野


Archive | 2007

Process for producing thermally conductive resin sheet, thermally conductive resin sheet and power module using the same

Atsuko Fujino; Seiki Hiramatsu; Hiromi Ito; Kenji Mimura; Takashi Nishimura; Hideki Takigawa; Toshiyuki Toyoshima; Kei Yamamoto; 研史 三村; 浩美 伊藤; 圭 山本; 星紀 平松; 秀記 瀧川; 敦子 藤野; 隆 西村; 利之 豊島


Archive | 2007

Circuit board and method of manufacturing the same, and semiconductor module

Atsuko Fujino; Seiki Hiramatsu; Hiromi Ito; Motoki Masaki; Kenji Mimura; Takashi Nishimura; Hironori Shioda; Hideki Takigawa; Kei Yamamoto; 研史 三村; 浩美 伊藤; 裕基 塩田; 圭 山本; 星紀 平松; 元基 正木; 秀記 瀧川; 敦子 藤野; 隆 西村

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