Gernot Schimetta

Product having a sensor and a surface acoustic wave element, as well as a method and arrangement for determining a measurement variable, which corresponds to a reactance, by a sensor

Module with an electronic component electrically connected between two substrates, in particular DCB ceramic substrates, and production method thereof

Method for electrical insulation of unpackaged electronic construction element, particularly high power element or semiconductor high power element, involves fastening or electrical contacting of connection surface on lower surface

Appliance for determining measured variables corresponding to reactive resistance of sensor connected to surface acoustic wave (SAW) element matching network

Economical high-frequency package

Modul mit elektronischem Bauelement zwischen zwei Substraten, insbesondere DCB-Keramiksubstraten, dessen Herstellung und Kontaktierung

Aufbau- und Verbindungstechnik von Modulen mittels dreidimensional geformter Leadframes

Method for manufacturing and making planar contact with an electronic apparatus, and correspondingly manufactured apparatus

Chip module, particularly power module, comprises chip which is provided with main side with one or multiple chip contact surfaces, where structured sheet metal layer is provided with main side

Kostengünstiges Hochfrequenz-Package