B. Heying

Role of threading dislocation structure on the x‐ray diffraction peak widths in epitaxial GaN films

In this letter we demonstrate that the anomalously low (002) x‐ray rocking curve widths for epitaxial hexagonal GaN films on (001) sapphire are a result of a specific threading dislocation (TD) geometry. Epitaxial GaN films were grown on c‐plane sapphire by atmospheric pressure metalorganic chemical vapor deposition (MOCVD) in a horizontal flow reactor. Films were grown with (002) rocking curves (ω‐scans) widths as low as 40 arcsec and threading dislocation densities of ∼2×1010 cm−2. The threading dislocations in this film lie parallel to the [001] direction and within the limit of imaging statistics, all are pure edge with Burgers vectors parallel to the film/substrate interface. These TDs will not distort the (002) planes. However, distortion of asymmetric planes, such as (102), is predicted and confirmed in (102) rocking curve widths of 740 arcsec. These results are compared with films with (002) rocking curves of ∼270 arcsec and threading dislocation densities of ∼7×108 cm−2.

Control of GaN surface morphologies using plasma-assisted molecular beam epitaxy

The characteristic surface morphologies of GaN grown by plasma-assisted molecular beam epitaxy under various growth conditions have been investigated. Three growth regimes (one N stable and two Ga stable) are identified on a surface structure diagram (Ga/N ratio versus substrate temperature). The boundary between the N-stable regime (low Ga/N ratios) and the two Ga-stable regimes (high Ga/N ratios) is determined by the growth rate of the films and is constant over the range of substrate temperatures investigated. The boundary between the two Ga-stable regimes (the Ga-droplet regime and the intermediate regime) is determined by the formation of Ga droplets and has an Arrhenius dependence with substrate temperature. The characteristic morphologies of films grown within each of these regimes are investigated using atomic force microscopy and transmission electron microscopy. N-stable films have rough, heavily pitted morphologies. Films grown within the intermediate phase have areas of flat surface between la...

Homoepitaxial growth of GaN under Ga-stable and N-stable conditions by plasma-assisted molecular beam epitaxy

The structure, morphology, and optical properties of homoepitaxial GaN layers grown by molecular beam epitaxy on metalorganic chemical vapor deposition (MOCVD)-grown GaN “template” layers were investigated as a function of the group III/group V flux ratio during growth. GaN layers grown with a low III/V ratio (N-stable growth) displayed a faceted surface morphology and a tilted columnar structure with a high density of stacking faults. In contrast, films grown with a high III/V ratio (Ga-stable growth) displayed comparable structure to the underlying MOCVD-grown template. The transition from N-stable to Ga-stable growth modes was found to occur over a narrow range of Ga fluxes at a growth temperature of 650 °C. Evidence of Ga accumulation and step-flow growth was observed for films grown under Ga-stable conditions, leading to the formation of spiral growth features at the surface termination of mixed edge/screw dislocations. Photoluminescence measurements indicate that the deep-level (∼550 nm) emission is...

POLARIZATION-INDUCED CHARGE AND ELECTRON MOBILITY IN ALGAN/GAN HETEROSTRUCTURES GROWN BY PLASMA-ASSISTED MOLECULAR-BEAM EPITAXY

The formation of the two-dimensional electron gas (2DEG) in unintentionally doped AlxGa1−xN/GaN (x⩽0.31) heterostructures grown by rf plasma-assisted molecular-beam epitaxy is investigated. Low-temperature electrical-transport measurements revealed that the two-dimensional electron gas density strongly depends on both the thickness of the AlGaN layer and alloy composition. The experimental results agree very well with the theoretical estimates of the polarization-induced 2DEG concentrations. Low-temperature electron mobility was found to be much higher in the structures with lower electron sheet densities. Interface roughness scattering or alloy disorder scattering are proposed to be responsible for this trend. A maximum mobility of 51 700 cm2/V s (T=13 K) was obtained in the Al0.09Ga0.91N/GaN structure with a two-dimensional electron gas density of 2.23×1012 cm−2.

Structural evolution in epitaxial metalorganic chemical vapor deposition grown GaN films on sapphire

The structural evolution of epitaxial GaN layers grown on basal plane sapphire has been studied by atomic force microscopy (AFM), x‐ray diffraction, and transmission electron microscopy (TEM). High‐temperature growth (1050–1080 °C) on optimized nucleation layers leads to clear, specular films. AFM on the as‐grown surface shows evenly spaced monatomic steps indicative of layer by layer growth. AFM measurements show a step termination density of 1.7×108 cm−2 for 5 μm films. This value is in close agreement with TEM measurements of screw and mixed screw‐edge threading dislocation density. The total measured threading dislocation density in the 5 μm films is 7×108 cm−2.

Dislocation mediated surface morphology of GaN

The surfaces of GaN films grown by metalorganic chemical vapor deposition (MOCVD) and molecular beam epitaxy (MBE) were studied using atomic force microscopy (AFM). Due to the high dislocation densities in the films (108 cm−2), the typical surface morphologies of layers grown by both techniques were dominated by three dislocation mediated surface structures—pinned steps, spiral hillocks, and surface depressions. The characteristics of these surface structures were found to depend on growth technique (MOCVD vs MBE) and the group-III to group-V ratio used in the growth of MBE GaN films. Pinned steps, created by the intersections of mixed character dislocations with the free surface, were found on all GaN films. The pinned steps were observed to be predominantly straight on the MOCVD GaN and curved into spiral hillock formations on the MBE GaN. Spiral growth hillocks form when pinned steps grow outward and around the dislocation under step-flow growth conditions. The tightness of the spiral hillocks on MBE G...

Influence of sapphire nitridation on properties of gallium nitride grown by metalorganic chemical vapor deposition

The properties of 1.2 μm thick GaN films were found to be significantly influenced by the duration of exposing the sapphire substrate to ammonia prior to the GaN growth initiation. The different nitridation schemes of sapphire strongly affect the dislocation structure of GaN films resulting in a decrease of the dislocation density from 2×1010 to 4×108 cm−2 for shorter NH3 preflow times. Room‐ and low‐temperature electron transport characteristics of these films are specifically affected by the dislocation structure. A 300 K electron mobility as high as 592 cm2/V s was obtained for a short ammonia preflow whereas a long nitridation caused the mobility to drop to 149 cm2/V s. Additionally, the photoluminescence quality deteriorates for samples with a long sapphire nitridation time.

Nucleation layer evolution in metal‐organic chemical vapor deposition grown GaN

The structure and morphology of low growth temperature GaN nucleation layers have been studied using atomic force microscopy (AFM), reflection high energy electron diffraction (RHEED), and transmission electron microscopy (TEM). The nucleation layers were grown at 600 °C by atmospheric pressure metalorganic chemical vapor deposition (MOCVD) on c‐plane sapphire. The layers consist of predominantly cubic GaN (c‐GaN) with a high density of stacking faults and twins parallel to the film/substrate interface. The average grain size increases with increasing layer thickness and during the transition from low temperature (600 °C) to the high temperatures (1080 °C) necessary for the growth of device quality GaN. Upon heating to 1080 °C the nucleation layer partially converts to hexagonal GaN (h‐GaN) while retaining a high stacking fault density. The mixed cubic‐hexagonal character of the nucleation layer region is sustained after subsequent high‐temperature GaN growth.

Direct imaging of reverse-bias leakage through pure screw dislocations in GaN films grown by molecular beam epitaxy on GaN templates

Excess reverse-bias leakage in GaN films grown by molecular beam epitaxy on GaN templates is correlated with the presence of pure screw dislocations. A scanning current–voltage microscope was used to map the spatial locations of leakage current on high quality GaN films under reverse bias. Two samples with similar total dislocation density (∼109 cm−2) but with pure screw dislocation density differing by an order of magnitude were compared. We found that the density of reverse-bias leakage spots correlates well with pure screw dislocation density, not with mixed dislocation density. Thus, pure screw dislocations have a far more detrimental impact on gate leakage than edge or mixed dislocations.

Optimization of the surface morphologies and electron mobilities in GaN grown by plasma-assisted molecular beam epitaxy

The morphology and electrical properties of homoepitaxial GaN layers grown by molecular beam epitaxy at 720 °C were investigated as a function of Ga/N ratio. GaN films grown with low Ga/N ratios (N-stable regime) are semi-insulating and have heavily pitted morphologies. GaN films grown with higher Ga/N ratios (intermediate regime) have fewer pits with areas of atomically flat surface. The room-temperature electron mobilities in samples grown in the intermediate regime are greater than 800 cm2/V s and increase with Ga/N ratio. At the highest Ga/N ratios (Ga-droplet regime), Ga droplets formed on the surface during growth. Although the surface morphology is free of pits and atomically flat for films grown within the Ga-droplet regime, the mobility decreases significantly compared to films grown in the intermediate regime. Room-temperature electron mobilities as high as 1191 cm2/V s were measured in a GaN film grown with the highest Ga/N ratio within the intermediate regime.