B. Welles Ii Kenneth

Method for packaging integrated circuit chips employing a polymer film overlay layer

A method and apparatus are provided for disposing a polymer film on an irregularly-shaped substrate at relatively high temperatures. In particular, the method and apparatus of the present invention provide a system for the packaging of very large scale intergrated circuit chips. The system of the present invention particularly solves problems associated with high temperature processing and problems associated with the highly irregular surfaces that result. Nonetheless, the resultant product is capable of being fashioned into circuit chip systems which are independently testable and which may be reconfigured after testing by removal of the polymer film itself.

Method and apparatus for coherent imaging system

A method and apparatus for improved digital processing of the analog echo signals in a coherent imaging system is described which simplifies the channel circuitry requirements. The analog echo signals detected with a phased array of transducer elements are first compressed in a non-linear manner then expanded non-linearly with analog-to-digital converter means to provide increased instantaneous dynamic range in the overall system. Representative phased array coherent imaging systems having the improved digital processing means are also disclosed.

Architecture for ultrasonic imaging

An ultrasonic imaging processing system includes transducers and means to generate in an analog fashion, in-phase and quadrature phase signals. These signals are converted to digital form and a butterfly phase rotator circuit is employed to correct for phase differences in beam steering and focusing. In particular, speed and simplicity is achieved through the utilization of read only memory means providing appropriate function values for phase correction in conjunction with digital multiplication and summing circuitry.