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Dive into the research topics where Barry L. Chin is active.

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Featured researches published by Barry L. Chin.


international conference on solid state and integrated circuits technology | 2001

Cu barrier/seed technology development for sub-0.10 micron copper chips

Peijun Ding; Ling Chen; Jianming Fu; Barry L. Chin; Roderick Craig Mosely; Zheng Xu; Gongda Yao

Advanced PVD technologies have been reviewed for copper barrier-seed applications for different device nodes. Each new device generation requires improved step coverage and reduced overhang. With each shift in deposition technology, there have been process and hardware advancements to meet decreasing feature sizes and increasing aspect ratios. The extension of PVD to 0.1 /spl mu/m has delayed the need for a CVD barrier and seed solution. However, PVDs limitations in step coverage, and the introduction of porous low-k dielectrics may necessitate a transition to CVD barriers below 0.10 /spl mu/m. The process integration of SIP-Cu and a proven barrier solution TDMAT (tetrakis dimethyl amino titanium)-based CVD TiSiN is also discussed in this paper.


Archive | 2004

Method of preventing diffusion of copper through a tantalum-comprising barrier layer

Tony Chiang; Gongda Yao; Peijun Ding; Fusen E. Chen; Barry L. Chin; Gene Y. Kohara; Zheng Xu; Hong Zhang


Archive | 2001

Damage-free sculptured coating deposition

Tony Chiang; Gongda Yao; Peijun Ding; Fusen E. Chen; Barry L. Chin; Gene Y. Kohara; Zheng Xu; Hong Zhang


Archive | 1997

Sputtering methods for depositing stress tunable tantalum and tantalum nitride films

Tony Chiang; Peijun Ding; Barry L. Chin


Archive | 1998

Stress tunable tantalum and tantalum nitride films

Tony Chiang; Peijun Ding; Barry L. Chin; Bingxi Sun


Archive | 1997

Method of sputtering copper to fill trenches and vias

Peijun Ding; Tony Chiang; Barry L. Chin


Archive | 2002

Integrated barrier layer structure for copper contact level metallization

Tony Chiang; Peijun Ding; Barry L. Chin


Archive | 2005

Method of depositing a tantalum nitride/tantalum diffusion barrier layer system

Peijun Ding; Zheng Xu; Hong Zhang; Xianmin Tang; Praburam Gopalraja; Suraj Rengarajan; John C. Forster; Jianming Fu; Tony Chiang; Gongda Yao; Fusen E. Chen; Barry L. Chin; Gene Y. Kohara


Archive | 2006

Method of depositing a metal seed layer on semiconductor substrates

Tony Chiang; Gongda Yao; Peijun Ding; Fusen E. Chen; Barry L. Chin; Gene Y. Kohara; Zheng Xu; Hong Zhang


Archive | 2005

Method of depositing low resistivity barrier layers for copper interconnects

Peijun Ding; Zheng Xu; Hong Zhang; Xianmin Tang; Praburam Gopalraja; Suraj Rengarajan; John C. Forster; Jianming Fu; Tony Chiang; Gongda Yao; Fusen E. Chen; Barry L. Chin; Gene Y. Kohara

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