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Dive into the research topics where Gongda Yao is active.

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Featured researches published by Gongda Yao.


Vacuum | 1998

Sub-quarter micron metallization using ionized metal plasma (IMP) technology

Yoichiro Tanaka; Zheng Xu; Praburam Gopalraja; John C. Forster; Gongda Yao; Hong Zhang; Jaim Nulman; Fusen E. Chen

Abstract Ionized metal plasma (IMP) technology has been developed for liners and wetting layer deposition of sub-quarter-micron devices. Numerical modeling showed the unique advantages of IMP source over ECR source and long throw sputtering in enhancing bottom coverage. TiN bottom coverage up to 70% were demonstrated. The deposition rate, uniformity, bottom coverage and film stress were optimized by tuning rf and dc powers, process pressure and bias power. The TiN film microstructure such as crystal orientation and grain size was controlled by process parameters. An IMP TiN x ( x x wetting layer. The via resistance was improved by IMP Ti deposition.


Archive | 2004

Method of preventing diffusion of copper through a tantalum-comprising barrier layer

Tony Chiang; Gongda Yao; Peijun Ding; Fusen E. Chen; Barry L. Chin; Gene Y. Kohara; Zheng Xu; Hong Zhang


Archive | 2005

Method of depositing a tantalum nitride/tantalum diffusion barrier layer system

Peijun Ding; Zheng Xu; Hong Zhang; Xianmin Tang; Praburam Gopalraja; Suraj Rengarajan; John C. Forster; Jianming Fu; Tony Chiang; Gongda Yao; Fusen E. Chen; Barry L. Chin; Gene Y. Kohara


Archive | 2006

Method of depositing a metal seed layer on semiconductor substrates

Tony Chiang; Gongda Yao; Peijun Ding; Fusen E. Chen; Barry L. Chin; Gene Y. Kohara; Zheng Xu; Hong Zhang


Archive | 2005

Method of depositing low resistivity barrier layers for copper interconnects

Peijun Ding; Zheng Xu; Hong Zhang; Xianmin Tang; Praburam Gopalraja; Suraj Rengarajan; John C. Forster; Jianming Fu; Tony Chiang; Gongda Yao; Fusen E. Chen; Barry L. Chin; Gene Y. Kohara


Archive | 1997

Active shield for generating a plasma for sputtering

Praburam Gopalraja; Ralf Hofmann; Avi Tepman; Gongda Yao


Archive | 2007

Metal / metal nitride barrier layer for semiconductor device applications

Peijun Ding; Zheng Xu; Hong Zhang; Xianmin Tang; Praburam Gopalraja; Suraj Rengarajan; John C. Forster; Jianming Fu; Tony Chiang; Gongda Yao; Fusen E. Chen; Barry L. Chin; Gene Y. Kohara


Archive | 2008

Method of depositing a diffusion barrier layer which provides an improved interconnect

Peijun Ding; Zheng Xu; Hong Zhang; Xianmin Tang; Praburam Gopalraja; Suraj Rengarajan; John C. Forster; Jianming Fu; Tony Chiang; Gongda Yao; Fusen E. Chen; Barry L. Chin; Gene Y. Kohara


Archive | 2008

Damage-free sculptured coating deposition method

Fusen Chen; Tony Chiang; Barry Chin; Peijun Ding; Gene Y. Kohara; Zheng Xu; Gongda Yao; Hong Zhang; ツェン キュー; ジェネ コハラ; フセン チェン; トニー チャン; ホン チャン; バリー チン; ペイジュン ディン; ゴングダ ヤオ


Archive | 2009

Method of depositing a metal seed layer over recessed feature surfaces in a semiconductor substrate

Tony Chiang; Gongda Yao; Peijun Ding; Fusen E. Chen; Barry L. Chin; Gene Y. Kohara; Zheng Xu; Hong Zhang

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