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Bernhard Zuhr

Infineon Technologies

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Publication

Featured researches published by Bernhard Zuhr.

Archive | 2004

Semiconductor module with a semiconductor stack, and methods for its production

Jens Pohl; Bernd Roemer; Bernhard Schaetzler; Christian Stuempfl; Herman Vilsmeier; Holger Woerner; Bernhard Zuhr

Archive | 2002

Electronic component comprises a stack of semiconductor chips of different size with one chip having a recess on its passive rear side

Bernhard Zuhr

Archive | 2005

Semiconductor device stack and method for its production

Michael Bauer; Ulrich Bachmaier; Robert-Christian Hagen; Jens Pohl; Rainer Steiner; Hermann Vllsmeler; Holger Woerner; Bernhard Zuhr

Archive | 2004

Semiconductor base component for semiconductor component pile, has boundary regions of substrate surrounding chip, with elastic contact unit which is electrically connected with regions of distribution plate

Gottfried Beer; Jens Pohl; Bernhard Zuhr

Archive | 2007

Semiconductor component with plastic housing, and process for producing the same

Ulrich Bachmaier; Michael Bauer; Robert Hagen; Jens Pohl; Rainer Steiner; Peter Strobel; Hermann Vilsmeier; Holger Woerner; Bernhard Zuhr

Archive | 2004

Halbleiterbasisbauteil mit Verdrahtungssubstrat und Zwischenverdrahtungsplatte für einen Halbleiterbauteilstapel sowie Verfahren zu deren Herstellung

Jens Pohl; Hermann Vilsmeier; Holger Wörner; Bernhard Zuhr; Rainer Steiner; Michael Bauer; Robert-Christian Hagen; Ulrich Bachmaier

Archive | 2005

Base semiconductor component comprising a wiring substrate and an intermediate wiring plate for a semiconductor component stack and a method for producing said component

Jens Pohl; Hermann Vilsmeier; Holger Wörner; Bernhard Zuhr; Rainer Steiner; Michael Bauer; Robert-Christian Hagen; Ulrich Bachmaier

Archive | 2004

Semiconductor base member with the wiring substrate and intermediate wiring board for a semiconductor device stack as well as processes for their preparation

Ulrich Bachmaier; Michael Bauer; Robert Dr.-Ing. Hagen; Jens Pohl; Rainer Steiner; Hermann Vilsmeier; Holger Wörner; Bernhard Zuhr

Archive | 2004

Halbleiterbasisbauteil mit Verdrahtungssubstrat und Zwischenverdrahtungsplatte für einen Halbleiterbauteilstapel sowie Verfahren zu deren Herstellung Basic semiconductor device having wiring substrate and intermediate wiring board for a semiconductor component stack and process for their preparation

Ulrich Bachmaier; Michael Bauer; Robert Dr.-Ing. Hagen; Jens Pohl; Rainer Steiner; Hermann Vilsmeier; Holger Wörner; Bernhard Zuhr

Archive | 2004

Halbleiterbauteil mit Kunststoffgehäuse und Verfahren zur Herstellung desselben Of the same semiconductor device with plastic housing and methods for preparing

Ulrich Bachmaier; Michael Bauer; Robert Dr.-Ing. Hagen; Jens Pohl; Rainer Steiner; Peter Strobel; Hermann Vilsmeier; Holger Wörner; Bernhard Zuhr

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Jens Pohl

Siemens

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Hermann Vilsmeier

Infineon Technologies

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Michael Bauer

Infineon Technologies

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Rainer Steiner

Infineon Technologies

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Ulrich Bachmaier

Infineon Technologies

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Bernd Römer

Infineon Technologies

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Bernhard Schätzler

Infineon Technologies

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Holger Woerner

Infineon Technologies

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Holger Wörner

Rolf C. Hagen Group

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Peter Strobel

Infineon Technologies

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