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Holger Wörner

Infineon Technologies

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Publication

Featured researches published by Holger Wörner.

Archive | 2005

Encapsulation of semiconductor component with chip on substrate in mould tool of top and bottom half after fitting elastic cover over chip

Edward Fürgut; Holger Wörner

Archive | 2003

Electronic component comprises a semiconductor chip with contact surfaces on an active surface, a plastic housing composition in which the chip with side edges and a rear side are embedded, and a heat-conducting plate

Robert Hagen; Holger Wörner

Archive | 2002

Electronic component and method for producing the electronic component

Thomas Bemmerl; Holger Wörner; Bernd Waidhaus

Archive | 2006

Method of producing a universal semiconductor housing with precrosslinked plastic embedding compounds

Bernd Goller; Robert-Christian Hagen; Gerald Ofner; Christian Stuempfl; Stefan Wein; Holger Wörner

Archive | 2002

Electronic package having integrated cooling element with clearance for engaging package

Thomas Bemmerl; Holger Wörner; Bernd Waidhas

Archive | 2003

Halbleiterbauteil mit Halbleiterchip und Umverdrahtungslage sowie Verfahren zur Herstellung desselben

Edward Fürgut; Hermann Vilsmeier; Holger Wörner

Archive | 2002

Electronic component with two or more semiconductor chips, has circuit carrier flush with active surface of chips, forming fine wiring plane with contact terminals at edges

Bernd Goller; Robert-Christian Hagen; Christian Stümpfl; Stefan Wein; Holger Wörner

Archive | 2004

CHIP CARD, CHIP CARD MODULE AND METHOD FOR THE PRODUCTION OF A CHIP CARD MODULE

Holger Wörner; Edward Fürgut; Bernd Goller; Jens Pohl; Peter Strobel; Simon Jerebic; Robert-Christian Hagen

Archive | 2002

Universelles Halbleitergehäuse mit vorvernetzten Kunststoffeinbettmassen und Verfahren zur Herstellung desselben

Bernd Goller; Robert-Christian Hagen; Gerald Ofner; Christian Stümpfl; Stefan Wein; Holger Wörner

Archive | 2005

Verfahren zum Aufbringen einer Umverdrahtung auf einen Nutzen unter Kompensation von Positionsfehlern und Halbleiterchips in Bauteilpositionen des Nutzens

Harry Hedler; Jens Pohl; Holger Wörner

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Collaboration

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Edward Fürgut

Infineon Technologies

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Robert-Christian Hagen

Infineon Technologies

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Bernd Goller

Infineon Technologies

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Michael Bauer

Infineon Technologies

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Christian Stümpfl

Infineon Technologies

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Jens Pohl

Infineon Technologies

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Simon Jerebic

Infineon Technologies

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Stefan Wein

Infineon Technologies

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Gerald Ofner

Infineon Technologies

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Hermann Vilsmeier

Infineon Technologies

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