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Dive into the research topics where Rainer Steiner is active.

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Featured researches published by Rainer Steiner.


electronics packaging technology conference | 2004

Package optimization of a stacked die flip chip based test package

Jens Pohl; Markus Graml; Peter Strobel; Rainer Steiner; Klaus Pressel; Stephan Stoeckl; Gerald Ofner; Charles Lee

We report a case study for the optimization of a flip chip based stacked die array test package. We demonstrate the importance of package substrate design and substrate thickness on the processibility and package warpage control. We found that for thin substrates copper balancing of the top and bottom die is crucial. We show the impact of flip chip die thickness and substrate thickness on the die attach of the top die(s) in the stack. Investigations on different top die attach alternatives show that tape die attach can have advantages. We demonstrate the importance of the vertical stack structure (i.e. flip chip thickness) and material selection (i.e. mold compound) on the overall warpage control of the package. The results show that even small changes in the package structure can have large impact on the warpage characteristics of the stacked die package


Archive | 2004

Semiconductor component with electromagnetic shielding device

Michael Bauer; Christian Birzer; Georg Ernst; Rainer Steiner; Hermann Vilsmeier; Holger Woerner


Archive | 2003

Electronic component with a housing package

Rainer Steiner; Horst Theuss


Archive | 2007

METHOD OF MANUFACTURING A SEMICONDUCOTOR DEVICE

Thorsten Meyer; Gerald Ofner; Rainer Steiner


Archive | 2009

DEVICE FABRICATED USING AN ELECTROPLATING PROCESS

Jens Pohl; Hans-Joachim Barth; Gottfried Beer; Rainer Steiner; Werner Robl; Mathias Vaupel


Archive | 2008

Verfahren zum herstellen eines halbleiterbauelements

Thorsten Meyer; Gerald Ofner; Rainer Steiner


Archive | 2007

Semiconductor device including covering a semiconductor with a molding compound and forming a through hole in the molding compound

Markus Brunnbauer; Jens Pohl; Rainer Steiner


Archive | 2010

Semiconductor device including molding compound layer forms a common plane with the surface of the semiconductor chip

Markus Brunnbauer; Jens Pohl; Rainer Steiner


Archive | 2005

Semiconductor device stack and method for its production

Michael Bauer; Ulrich Bachmaier; Robert-Christian Hagen; Jens Pohl; Rainer Steiner; Hermann Vllsmeler; Holger Woerner; Bernhard Zuhr


Archive | 2003

Elektronisches bauteil mit einer gehäusepackung

Rainer Steiner; Horst Theuss

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