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Bert Reents

Atotech

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Publication

Featured researches published by Bert Reents.

Archive | 2007

Electrolytic method for filling holes and cavities with metals

Bert Reents; Bernd Roelfs; Tafadzwa Magaya; Markus Youkhanis; René Wenzel; Soungsoo Kim

Archive | 2003

Device and method for electrolytically treating an at least superficially electrically conducting work piece

Reinhard Schneider; Stephan Kenny; Torsten Küssner; Wolfgang Plöse; Bert Reents; Heribert Streup

Archive | 2004

Method of electroplating a workpiece having high-aspect ratio holes

Bert Reents; Tafadzwa Magaya

Archive | 2005

Galvanic process for filling through-holes with metals, in particular of printed circuit boards with copper

Bert Reents; Thomas Pliet; Bernd Roelfs; Toshiya Fujiwara; René Wenzel; Markus Youkhanis; Soungsoo Kim

Archive | 2008

Device and method for the electrolytic plating of a metal

Kai-Jens Matejat; Sven Lamprecht; Timo Bangerter; Bert Reents

Archive | 2003

Electrolytic metallizing of a workpiece with bores of high aspect ratio useful for the electrodeposition of copper, e.g. onto conductive plates

Tafadzwa Magaya; Bert Reents

Archive | 2004

Galvanisches Verfahren zum Füllen von Durchgangslöchern mit Metallen, insbesondere von Leiterplatten mit Kupfer

Toshiya Fujiwara; Soungsoo Kim; Thomas Pliet; Bert Reents; Bernd Dr. Roelfs; René Wenzel; Markus Youkhanis

Archive | 2007

Elektrolytisches verfahren zum füllen von löchern und vertiefungen mit metallen Electrolytic process for filling of holes and wells with metal

Bert Reents; Bernd Roelfs; Tafadzwa Magaya; Markus Youkhanis; René Wenzel; Soungsoo Kim

Archive | 2005

Galvanischer prozess zur füllung von durchgangslöchern mit metallen, insbesondere von leiterplatten mit kupfer Galvanic process for filling of through-holes with metal, especially copper pcb with

Bert Reents; Thomas Pliet; Bernd Roelfs; Toshiya Fujiwara; René Wenzel; Markus Youkhanis; Soungsoo Kim

Archive | 2004

Galvanisches Verfahren zum Füllen von Durchgangslöchern mit Metallen, insbesondere von Leiterplatten mit Kupfer Galvanic process for filling through-holes with metals, in particular of printed circuit boards with copper

Toshiya Fujiwara; Soungsoo Kim; Thomas Pliet; Bert Reents; Bernd Dr. Roelfs; René Wenzel; Markus Youkhanis

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Collaboration

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Tafadzwa Magaya

Atotech

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Markus Youkhanis

Atotech

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René Wenzel

Atotech

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Soungsoo Kim

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Bernd Roelfs

Atotech

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Thomas Pliet

Atotech

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Toshiya Fujiwara

Atotech

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Bernd Dr. Roelfs

Atotech

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Heribert Streup

Atotech

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Kai-Jens Matejat

Atotech

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