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Dive into the research topics where Brian John Hayden is active.

Publication


Featured researches published by Brian John Hayden.


Archive | 1996

Ultrasonic flip chip bonding process and apparatus

Cuong Van Pham; Brian John Hayden; Bethany Joy Walles


Archive | 1995

Repairable flip-chip undercoating assembly and method and material for same

Robert Edward Belke; Bethany Joy Walles; Michael George Todd; Brian John Hayden


Archive | 1994

Ultrasonic flip chip process and apparatus

Cuong Van Pham; Brian John Hayden; Bethany Joy Walles


Archive | 1999

Bonding of semiconductor power devices

Jay Deavis Baker; Brian John Hayden; Cuong Van Pham


Archive | 1994

Method and apparatus for detecting wire bond pull test failure modes

Cuong Van Pham; Brian John Hayden


Archive | 1997

Method of soldering materials supported on low-melting substrates

Mark Stephen Topping; Cuong Van Pham; Brian John Hayden


Archive | 1997

Method for ultrasonic bonding flexible circuits

Brian John Hayden; Cuong Van Pham; Rosa Lynda Nuno; Mark Stephen Topping


Archive | 1996

A FLIP-CHIP ASSEMBLY

Robert Edward Belke; Bethany Joy Walles; Michael George Todd; Brian John Hayden


Archive | 1994

Method and apparatus for testing an integrated circuit using controlled wirebonding and wirebonding removal

Cuong Van Pham; Brian John Hayden; Bethany Joy Walles; Peter R. Cibirka


Archive | 1994

Method and adjustment for known good die testing using resilient conductive straps

Bethany Joy Walles; Cuong Van Pham; Lawrence Leroy Kneisel; Brian John Hayden

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