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Dive into the research topics where Brian Lu is active.

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Featured researches published by Brian Lu.


international conference on solid-state and integrated circuits technology | 2008

Atomic level solutions® for advanced microelectronic applications

Yoshi Senzaki; Tom Seidel; J. McCormick; Gi Kim; H. Y. Kim; Zia Karim; Brian Lu; Sasangan Ramanathan; Johannes Lindner; Hugo Silva; M. Daulesberg

Atomic Layer Deposition (ALD) has successfully been applied to advanced microelectronic applications importantly for conformal coatings on high aspect ratio devices. However, traditional ALD is limited in deposition rate because the ability to bring precursors rapidly to the surface. In this paper we review recent results for precursor delivery using advanced vaporization (Trijet) as well as recent advances in Pulsed CVD (AVD®) using art elements held in common with ALD technology. These and other advances - such as Multiple Single Wafer configurations allow ALD application for continued scaling under conditions of improved process control and higher productivity. Key applications include: capacitors (dielectrics and electrodes), transistors and contacts. This paper reviews these technological advances in the context of their applications.


Archive | 2013

METHOD FOR FORMING TiSiN THIN FILM LAYER BY USING ATOMIC LAYER DEPOSITION

Woong Park; Young Jin Jang; Gi Kim; Brian Lu; Greg Siu; Hugo Silva; Sasangan Ramanathan


217th ECS Meeting | 2010

Invited) Innovative Deposition Technology for Advanced Materials

Peter K. Baumann; M. Heuken; U. Weber; P. Lehnen; Yoshi Senzaki; Johannes Lindner; Brian Lu; Ziaul Karim; B. Schineller


Archive | 2015

Methods and systems for growing binary, ternary and quaternary materials on a substrate

Ming-Te Liu; Lin Yang; Jerry Mack; Zia Karim; Brian Lu


Archive | 2014

Method and Apparatus For Growing Binary, Ternary and Quaternary Materials on a Substrate

Ming-Te Liu; Lin Yang; Jerry Mack; Zia Karim; Brian Lu


2014 ECS and SMEQ Joint International Meeting (October 5-9, 2014) | 2014

Reason and Role of Atomic Layer Deposition for PCRAM and ReRAM Films

Zia Karim; Kay Song; Lin Yang; Brian Lu


Frontiers in Electronic Materials: A Collection of Extended Abstracts of the Nature Conference Frontiers in Electronic Materials, June 17 to 20 2012, Aachen, Germany | 2013

Nanosession: Atomic Layer Deposition

Cheol Seong Hwang; Woongkyu Lee; Jeong Hwan Han; Woojin Jeon; Yeon Woo Yoo; Changhee Ko; Julien Gatineau; B. Gouat; U. Weber; Peter K. Baumann; M. Heuken; Brian Lu; Susanne Hoffmann-Eifert; M. Reiners; N. Aslam; I. Kärkkänen; J. H. Kim; Rainer Waser; Taeyong Eom; Taehong Gwon; Si Jung Yoo; Moo-Sung Kim; Manchao Xiao; Iain Buchanan


Conference Proceedings by the Society for Solid State and Electrochemical Science and Technology | 2012

Advances in ALD GST Process and Equipment for sub-20nm PCRAM Devices : Precursor delivery, GST Gapfill and Electrical Characterization

Zia Karim; Lin Yang; Jerry Mack; Ming Liu; U. Weber; Peter Baumann; Sasangan Ramanathan; Brian Lu; Wally Czubatyj; Stephen J. Hudgens; Tyler Lowrey


12th International Conference on Atomic Layer Deposition, American Vacuum Society | 2012

Deposition and Electrical Characterization of ALD GexSbyTez for Future Applications

Lin Yang; U. Weber; P. K. Maumann; Zia Karim; Sasangan Ramanathan; Brian Lu; Wally Czubatyj; Stephen J. Hudgens; Tyler Lowrey


Symposium on Manufacturing and Technology Section MS2, American Vacuum Society | 2011

Material and Tool Design Challenges for Taking ALD to High Volume Production Beyond 30nm Node

Brian Lu; Zia Karim; Sasangan Ramanathan

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M. Heuken

RWTH Aachen University

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Tyler Lowrey

University of Rochester

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P. Lehnen

Katholieke Universiteit Leuven

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