Bruno Heusdens
University of Liège
Network
Latest external collaboration on country level. Dive into details by clicking on the dots.
Publication
Featured researches published by Bruno Heusdens.
2012 4th Electronic System-Integration Technology Conference | 2012
Serguei Stoukatch; Philippe Laurent; S. Dricot; Fabrice Axisa; L. Seronveaux; D. Vandormael; E. Beeckman; Bruno Heusdens; Jacques Destiné
We evaluated suitability of AJP (Aerosol Jet Printing) deposited silver layer on variety of organic substrates for the most common interconnect techniques used for electronic packaging. Specifically, we checked if the AJP silver layer can be electrically interconnected by Au and Al wires bonding technique. We also evaluated suitability of AJP silver layer for surface-mount technology (SMT). We performed electrical characterization of the AJP silver layer. We realized a fully functional working prototype of Autonomous Wireless Sensor Node system using AJP silver conductive track as an electrical interconnection.
international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems | 2009
Véronique Rochus; Stefanie Gutschmidt; Jean-Claude Golinval; Michel Saint-Mard; Bruno Heusdens; Fabrice Haudry; Jacques Destiné
Since many years, the University of Liège is involved in micro-electronics and micro-electromechanical systems modelling, design and integration. Recently, the University of Liege had received the opportunity to build a brand new infrastructure (clean rooms - ISO 7) with specific equipments for packaging and MEMS characterisation. This new facility (clean rooms and equipments) enables the University to be very well positioned in the nano/micro-electronics modelling, analysis and packaging world and is now able to answer specific research and related industrial needs. In this paper we consider the design of a vibration sensor in its significantly vibrating surroundings and investigate in its dynamical behaviour. Environmental vibrations affect the sensor part of the MEMS device and influence the choice of the “best” packaging methods for the application. Within the framework of packaging, we consider a simple test application ensuring best interconnection technology. Dynamical investigations include a preliminary analysis of the packaging and a separate finite-element analysis of the MEMS device (inside the package), testing the device under the condition of a harsh environment (high vibration spectral level). Computations are proposed in combination with experimental observations.
Archive | 2013
Didier Deplaen; Bruno Heusdens; François Dupont; Michel Saint-Mard
Archive | 2011
Serguei Stoukatch; Nancy Van Overstraeten-Schlögel; Stéphanie Van Loo; Fabrice Axisa; Bruno Heusdens; Jacques Destiné; Denis Flandre
Archive | 2012
Serguei Stoukatch; Ester Tooten; Fabrice Axisa; Bruno Heusdens; Laurent Francis; Jacques Destiné
Archive | 2009
Michel Saint-Mard; Bruno Heusdens; Fabrice Haudry; Véronique Rochus; Stefanie Gutschmidt; Jacques Destiné; Jean-Claude Golinval
Archive | 2013
Michel Saint-Mard; Serguei Stoukatch; Karsten Schischke; Philippe Laurent; Bruno Heusdens; Tobias Xhonneux; N. Maillard; Fabrice Axisa; Jacques Destiné
Archive | 2011
Didier Deplaen; Bruno Heusdens; François Dupont; Michel Saint-Mard
International Bio-Sensing Technology Conference (BITE) | 2011
Nancy Van Overstraeten; Pascal Dupuis; O. Lefèvre; Delphine Magnin; Sophie Demoustier-Champagne; Alain M. Jonas; Bruno Heusdens; Serguei Stoukatch; S. van Loo; Denis Flandre
Archive | 2010
Nicolas Vandewalle; Tristan Gilet; Christine Jérôme; Bruno Heusdens