Byeongmoon Lee

Fully printable, strain-engineered electronic wrap for customizable soft electronics

Rapid growth of stretchable electronics stimulates broad uses in multidisciplinary fields as well as industrial applications. However, existing technologies are unsuitable for implementing versatile applications involving adaptable system design and functions in a cost/time-effective way because of vacuum-conditioned, lithographically-predefined processes. Here, we present a methodology for a fully printable, strain-engineered electronic wrap as a universal strategy which makes it more feasible to implement various stretchable electronic systems with customizable layouts and functions. The key aspects involve inkjet-printed rigid island (PRI)-based stretchable platform technology and corresponding printing-based automated electronic functionalization methodology, the combination of which provides fully printed, customized layouts of stretchable electronic systems with simplified process. Specifically, well-controlled contact line pinning effect of printed polymer solution enables the formation of PRIs with tunable thickness; and surface strain analysis on those PRIs leads to the optimized stability and device-to-island fill factor of strain-engineered electronic wraps. Moreover, core techniques of image-based automated pinpointing, surface-mountable device based electronic functionalizing, and one-step interconnection networking of PRIs enable customized circuit design and adaptable functionalities. To exhibit the universality of our approach, multiple types of practical applications ranging from self-computable digital logics to display and sensor system are demonstrated on skin in a customized form.

Revisit to three-dimensional percolation theory: Accurate analysis for highly stretchable conductive composite materials

A percolation theory based on variation of conductive filler fraction has been widely used to explain the behavior of conductive composite materials under both small and large deformation conditions. However, it typically fails in properly analyzing the materials under the large deformation since the assumption may not be valid in such a case. Therefore, we proposed a new three-dimensional percolation theory by considering three key factors: nonlinear elasticity, precisely measured strain-dependent Poisson’s ratio, and strain-dependent percolation threshold. Digital image correlation (DIC) method was used to determine actual Poisson’s ratios at various strain levels, which were used to accurately estimate variation of conductive filler volume fraction under deformation. We also adopted strain-dependent percolation threshold caused by the filler re-location with deformation. When three key factors were considered, electrical performance change was accurately analyzed for composite materials with both isotropic and anisotropic mechanical properties.

F-number matching method in light field microscopy using an elastic micro lens array

In light field microscopy (LFM), the F-number of the micro lens array (MLA) should be matched with the image-side F-number of the objective lens to utilize full resolution of an image sensor. We propose a new F-number matching method that can be applied to multiple objective lenses by using an elastic MLA. We fabricate an elastic MLA with polydimethylsiloxane (PDMS) using a micro contact printing method and address the strain for the F-number variation. The strain response is analyzed, and the LFM system with the elastic MLA is demonstrated. Our proposed system can increase the F-number up to 27.3% and can be applied to multiple objective lenses.

Electronic skins for soft, compact, reversible assembly of wirelessly activated fully soft robots

A skin-like driving system enables compact and reversible assembly of wirelessly activated, fully soft robots. Designing softness into robots holds great potential for augmenting robotic compliance in dynamic, unstructured environments. However, despite the body’s softness, existing models mostly carry inherent hardness in their driving parts, such as pressure-regulating components and rigid circuit boards. This compliance gap can frequently interfere with the robot motion and makes soft robotic design dependent on rigid assembly of each robot component. We present a skin-like electronic system that enables a class of wirelessly activated fully soft robots whose driving part can be softly, compactly, and reversibly assembled. The proposed system consists of two-part electronic skins (e-skins) that are designed to perform wireless communication of the robot control signal, namely, “wireless inter-skin communication,” for untethered, reversible assembly of driving capability. The physical design of each e-skin features minimized inherent hardness in terms of thickness (<1 millimeter), weight (~0.8 gram), and fragmented circuit configuration. The developed e-skin pair can be softly integrated into separate soft body frames (robot and human), wirelessly interact with each other, and then activate and control the robot. The e-skin–integrated robotic design is highly compact and shows that the embedded e-skin can equally share the fine soft motions of the robot frame. Our results also highlight the effectiveness of the wireless inter-skin communication in providing universality for robotic actuation based on reversible assembly.

Printed cylindrical lens pair for application to the seam concealment in tiled displays

Seamless tiling of displays is one of the key enabling technologies for the next-generation large-area electronics applications. In this paper, we propose a facile method to demonstrate a seamless display using cylindrical lens pair (CLP) fabricated by dispenser printing method. Optical properties of the printed CLP and corresponding capability of concealing seam in the display are analyzed by a set of luminance simulation and measurement in terms of geometric parameters of the lens. The seamless display with an optimized CLP features a viewing angle of the seam concealment of 40°.