Eunho Oh

Fully printable, strain-engineered electronic wrap for customizable soft electronics

Rapid growth of stretchable electronics stimulates broad uses in multidisciplinary fields as well as industrial applications. However, existing technologies are unsuitable for implementing versatile applications involving adaptable system design and functions in a cost/time-effective way because of vacuum-conditioned, lithographically-predefined processes. Here, we present a methodology for a fully printable, strain-engineered electronic wrap as a universal strategy which makes it more feasible to implement various stretchable electronic systems with customizable layouts and functions. The key aspects involve inkjet-printed rigid island (PRI)-based stretchable platform technology and corresponding printing-based automated electronic functionalization methodology, the combination of which provides fully printed, customized layouts of stretchable electronic systems with simplified process. Specifically, well-controlled contact line pinning effect of printed polymer solution enables the formation of PRIs with tunable thickness; and surface strain analysis on those PRIs leads to the optimized stability and device-to-island fill factor of strain-engineered electronic wraps. Moreover, core techniques of image-based automated pinpointing, surface-mountable device based electronic functionalizing, and one-step interconnection networking of PRIs enable customized circuit design and adaptable functionalities. To exhibit the universality of our approach, multiple types of practical applications ranging from self-computable digital logics to display and sensor system are demonstrated on skin in a customized form.

Revisit to three-dimensional percolation theory: Accurate analysis for highly stretchable conductive composite materials

A percolation theory based on variation of conductive filler fraction has been widely used to explain the behavior of conductive composite materials under both small and large deformation conditions. However, it typically fails in properly analyzing the materials under the large deformation since the assumption may not be valid in such a case. Therefore, we proposed a new three-dimensional percolation theory by considering three key factors: nonlinear elasticity, precisely measured strain-dependent Poisson’s ratio, and strain-dependent percolation threshold. Digital image correlation (DIC) method was used to determine actual Poisson’s ratios at various strain levels, which were used to accurately estimate variation of conductive filler volume fraction under deformation. We also adopted strain-dependent percolation threshold caused by the filler re-location with deformation. When three key factors were considered, electrical performance change was accurately analyzed for composite materials with both isotropic and anisotropic mechanical properties.

Electronic skins for soft, compact, reversible assembly of wirelessly activated fully soft robots

A skin-like driving system enables compact and reversible assembly of wirelessly activated, fully soft robots. Designing softness into robots holds great potential for augmenting robotic compliance in dynamic, unstructured environments. However, despite the body’s softness, existing models mostly carry inherent hardness in their driving parts, such as pressure-regulating components and rigid circuit boards. This compliance gap can frequently interfere with the robot motion and makes soft robotic design dependent on rigid assembly of each robot component. We present a skin-like electronic system that enables a class of wirelessly activated fully soft robots whose driving part can be softly, compactly, and reversibly assembled. The proposed system consists of two-part electronic skins (e-skins) that are designed to perform wireless communication of the robot control signal, namely, “wireless inter-skin communication,” for untethered, reversible assembly of driving capability. The physical design of each e-skin features minimized inherent hardness in terms of thickness (<1 millimeter), weight (~0.8 gram), and fragmented circuit configuration. The developed e-skin pair can be softly integrated into separate soft body frames (robot and human), wirelessly interact with each other, and then activate and control the robot. The e-skin–integrated robotic design is highly compact and shows that the embedded e-skin can equally share the fine soft motions of the robot frame. Our results also highlight the effectiveness of the wireless inter-skin communication in providing universality for robotic actuation based on reversible assembly.