Byung-Yoon Kim

Semiconductor device capable of preventing moisture-absorption of fuse area thereof

Semiconductor device capable of preventing moisture absorption of fuse area thereof and method for manufacturing the fuse area

Bonding pad structure of a semiconductor device and method for manufacturing the same

Contact structure having silicide layers, semiconductor device employing the same, and methods of fabricating the contact structure and semiconductor device

Power source voltage tracking circuit for stabilization of bit lines

Bonding pad structure for semiconductor device and manufacturing method therefor

Semiconductor Devices Having Contact Holes Including Protrusions Exposing Contact Pads and Methods of Fabricating the Same

Bonding pad structure of a semiconductor device

SEMICONDUCTOR DEVICES HAVING CONTACT PAD PROTECTION FOR REDUCED ELECTRICAL FAILURES AND METHODS OF FABRICATING THE SAME

Bonding pad structure for semiconductor integrated circuit, comprises bonding pad having first and second interconnection layers integral to each other, and peg(s) integral with the bonding pad