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Carl L. Deppisch

Intel

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Publication

Featured researches published by Carl L. Deppisch.

Archive | 2002

Electronic assembly having a wetting layer on a thermally conductive heat spreader

Carl L. Deppisch; Sabina J. Houle; Thomas J. Fitzgerald; Kristopher E. Dayton; Fay Hua

Archive | 2002

Integrated heat spreader package for heat transfer and for bond line thickness control and process of making

Kris J. Whittenburg; Fay Hua; Carl L. Deppisch; Sabina J. Houle; Peter Brandenburger; Kim L. Phillippe

Archive | 2002

Polymer with solder pre-coated fillers for thermal interface materials

Paul A. Koning; Fay Hua; Carl L. Deppisch

Archive | 2002

Device and method for package warp compensation in an integrated heat spreader

Thomas J. Fitzgerald; Carl L. Deppisch; Fay Hua

Archive | 2004

Electronic assembly having an indium wetting layer on a thermally conductive body

Fay Hua; Thomas J. Fitzgerald; Carl L. Deppisch; Gregory M. Chrysler

Archive | 2001

Coated heat spreaders

Joan K. Vrtis; Joni G. Hansen; Thomas J. Fitzgerald; Carl L. Deppisch

Archive | 2002

Electronic assembly having solder thermal interface between a die substrate and a heat spreader

Thomas J. Fitzgerald; Carl L. Deppisch; Fay Hua

Archive | 2003

Integrated solder and heat spreader fabrication

Carl L. Deppisch; Edward L. Martin; Sabina J. Houle; James P. Mellody; Marvin J. Burgess; Maureen A. Brown; Robert C. Deblieck; David P. Carroll

Archive | 2006

Electronic packaging apparatus and method

Thomas J. Fitzgerald; Carl L. Deppisch; Manjit Dhindsa; Mark Norwil; Matthew J. Schaenzer

Archive | 2002

Reactive solder material

Fay Hua; Carl L. Deppisch; Krista J. Whittenburg

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Collaboration

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Fay Hua

Intel

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Thomas J. Fitzgerald

Intel

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Joni G. Hansen

Intel

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Sabina J. Houle

Intel

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Rajen S. Sidhu

Intel

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Anna M. Prakash

Intel

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Ashay A. Dani

Intel

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Daewoong Suh

Intel

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Edward L. Martin

Intel

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James P. Mellody

Intel

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