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Anna M. Prakash

Intel

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Publication

Featured researches published by Anna M. Prakash.

Archive | 2005

Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same

Ashay A. Dani; Anna M. Prakash; Saikumar Jayaraman; Mitesh C. Patel; Vijay Wakharkar

Archive | 2008

SOLDER FLUX COMPOSITION AND PROCESS OF USING SAME

Anna M. Prakash

Archive | 2005

Chip package dielectric sheet for body-biasing

Ashay A. Dani; Anna M. Prakash; Saikumar Jayaraman; Mitesh C. Patel; Vijay Wakharkar

Archive | 2007

Flux precoated solder preform for thermal interface material

Lateef Mustapha; Carl L. Deppisch; Anna M. Prakash; Sai Jayaraman; Mike Reiter

Archive | 2008

Apparatus and methods of forming an interconnect between a workpiece and substrate

Lakshmi Supriya; Anna M. Prakash; Tommy L. Ashton

Archive | 2017

PERFORATED CONDUCTIVE MATERIAL FOR EMI SHIELDING OF SEMICONDUCTOR DEVICE AND COMPONENTS

Rajendra C. Dias; Joshua D. Heppner; Mitul Modi; Anna M. Prakash

Archive | 2017

SEMICONDUCTOR PACKAGE HAVING AN EMI SHIELDING LAYER

Anna M. Prakash; Reynaldo Olmedo; Venmathy Mcmahan; Rajendra C. Dias; Joshua D. Heppner; Ann Jinyan Xu; Sriya Sanyal; Eric J. Li

Archive | 2013

METHODS OF FORMING WAFER LEVEL UNDERFILL MATERIALS AND STRUCTURES FORMED THEREBY

Anna M. Prakash; James C. Matayabas; Arjun Krishnan; Nisha Ananthakrishnan

Archive | 2017

SYSTEMS AND METHODS FOR ELOECTROMAGNETIC INTERFERENCE SHIELDING

Rajendra C. Dias; Anna M. Prakash; Joshua D. Heppner; Eric J. Li; Nachiket R. Raravikar

Archive | 2016

Coated Probe Tips for Plunger Pins of an Integrated Circuit Package Test System

Wen Yin; Anna M. Prakash; Teag R. Haughan; Dingying David Xu; Joaquin Aguilar-Santillan

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Ashay A. Dani

Intel

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Joshua D. Heppner

Intel

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Rajendra C. Dias

Intel

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Carl L. Deppisch

Intel

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Eric J. Li

Intel

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James C. Matayabas

Intel

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Mitesh C. Patel

Intel

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Saikumar Jayaraman

Intel

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Vijay Wakharkar

Intel

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Ann Jinyan Xu

Intel

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