Carl Taussig

A polymer/semiconductor write-once read-many-times memory

Organic devices promise to revolutionize the extent of, and access to, electronics by providing extremely inexpensive, lightweight and capable ubiquitous components that are printed onto plastic, glass or metal foils. One key component of an electronic circuit that has thus far received surprisingly little attention is an organic electronic memory. Here we report an architecture for a write-once read-many-times (WORM) memory, based on the hybrid integration of an electrochromic polymer with a thin-film silicon diode deposited onto a flexible metal foil substrate. WORM memories are desirable for ultralow-cost permanent storage of digital images, eliminating the need for slow, bulky and expensive mechanical drives used in conventional magnetic and optical memories. Our results indicate that the hybrid organic/inorganic memory device is a reliable means for achieving rapid, large-scale archival data storage. The WORM memory pixel exploits a mechanism of current-controlled, thermally activated un-doping of a two-component electrochromic conducting polymer.

Electrochromic conductive polymer fuses for hybrid organic/inorganic semiconductor memories

We demonstrate a nonvolatile, write-once-read-many-times (WORM) memory device employing a hybrid organic/inorganic semiconductor architecture consisting of thin film p-i-n silicon diode on a stainless steel substrate integrated in series with a conductive polymer fuse. The nonlinearity of the silicon diodes enables a passive matrix memory architecture, while the conductive polyethylenedioxythiophene:polystyrene sulfonic acid polymer serves as a reliable switch with fuse-like behavior for data storage. The polymer can be switched at ∼2 μs, resulting in a permanent decrease of conductivity of the memory pixel by up to a factor of 103. The switching mechanism is primarily due to a current and thermally dependent redox reaction in the polymer, limited by the double injection of both holes and electrons. The switched device performance does not degrade after many thousand read cycles in ambient at room temperature. Our results suggest that low cost, organic/inorganic WORM memories are feasible for light weight...

Roll-to-roll manufacturing of electronics on flexible substrates using self-aligned imprint lithography (SAIL)

Abstract— The manufacture of large-area arrays of thin-film transistors on polymer substrates using roll-to-roll (R2R) processes exclusively is being developed. Self-aligned imprint lithography (SAIL) enables the patterning and alignment of submicron-sized features on meter-scaled flexible substrates in the R2R environment. SAIL solves the problem of precision interlayer registry on a moving web by encoding all the geometry information required for the entire patterning steps into a monolithic three-dimensional imprint with discrete thickness modulation. The pre-aligned multiple-step mask structure maintains its alignment regardless of subsequent substrate distortion. Challenges are encountered in relation to the novel nature of using flexible substrates and building toolsets for the R2R processing. In this paper, methods of the SAIL process, the resulting active-matrix backplanes, the trajectory of SAIL process development, and the remaining issues for production are presented.

Identification of sampled data systems at frequencies beyond the Nyquist rate

A practical algorithm is presented for identifying the dynamics of a continuous-time, linear, time-invariant system, embedded in a sampled feedback loop with fixed sample time, T. It is shown that if the closed-loop configuration is stable, it is rather straightforward to design a set of experiments using a spectrum analyzer that will identify the plant transfer function to frequencies well beyond the Nyquist frequency. Experimental results are included.<<ETX>>

Advances in roll-to-roll imprint lithography for display applications

A solution to the problems of roll-to-roll lithography on flexible substrates is presented. We have developed a roll-toroll imprint lithography technique to fabricate active matrix transistor backplanes on flexible webs of polyimide that have a blanket material stack of metals, dielectrics, and semiconductors. Imprint lithography produces a multi-level 3- dimensional mask that is then successively etched to pattern the underlying layers into the desired structures. This process, Self-Aligned Imprint Lithography (SAIL), solves the layer-to-layer alignment problem because all masking levels are created with one imprint step. The processes and equipment required for complete roll-to-roll SAIL fabrication will be described. Emphasis will be placed on the advances in the roll-to-roll imprint process which have enabled us to produce working transistor arrays.

23.4: Invited Paper: Active‐Matrix Backplanes Produced by Roll‐to‐Roll Self‐Aligned Imprint Lithography (SAIL)

Progress in the development of a fully roll-to-roll self-aligned imprint process for producing active matrix backplanes with submicron aligned features on flexible substrates is reported. High performance transistors, crossovers and addressable active matrix arrays have been designed and fabricated using imprint lithography. Such a process has the potential of significantly reducing the costs of large area displays. The progress, current status and remaining issues of this new fabrication technology are presented.

High-current-density thin-film silicon diodes grown at low temperature

High-performance thin-film silicon n–i–p diodes are fabricated at temperatures below 160°C using hot-wire chemical vapor deposition. The 0.01mm2 diodes have a forward current-density of near 1000A∕cm2 and a rectification ratio over 107 at ±2V. Use of microcrystalline silicon i and n layers results in higher current-density diodes than with amorphous silicon, primarily by lowering a barrier to carrier injection. A 30nm intrinsic Si buffer layer between the i and p layers is needed to reduce the reverse leakage current. Minimizing diode area increases forward current density by reducing the voltage drop across the external series resistances.

Adaptation of roll-to-roll imprint lithography: from flexible electronics to structural templates

HP has previously demonstrated the roll-to-roll (R2R) fabrication of active-matrix display backplanes using the Self-Aligned Imprint Lithography (SAIL) process. This approach permits a single imprint step to create a multi level mask comprising all patterns required for subsequent etching steps, obviating the need for multiple alignment steps. In this paper the imprint lithography technique and aspects of SAIL are reviewed. New work using imprint processing to generate structural templates, with aspect ratios approaching 6:1, for fluid containment will be presented. Arrays of transparent well structures, formed on a flexible transparent substrate provide the basis for a color display filter matrix that is filled by inkjet deposition of pigmented resins. A primary benefit of this approach is precise color pattern definition. A separation between primary color fields of 4 microns is realized without risk of color mixing or overlap. Components patterned with high absolute precision by imprint lithography were readily integrated with parts from other sources to yield flexible color reflective display demonstrator panels. This work highlights the flexibility of imprint processing and its suitability for use with a wide variety of materials and in differing applications.

Fabrication of three-dimensional imprint lithography templates by colloidal dispersions

Self-aligned imprint lithography (SAIL) enables the patterning and alignment of submicron-sized features on metre-scaled flexible substrates in the roll-to roll (R2R) environment. SAIL solves the problem of precision interlayer registry on a moving web by encoding all the geometry information required for the entire patterning steps into a monolithic three-dimensional mask that is imprinted on the thin film stack deposited on a flexible substrate. Soft molds made of plastics or elastomers cast on a silicon master have been used as stamps to pattern the 3D masks because of their low cost and ease of fabrication. However, the durability of these stamps is one factor that limits their efficiency in a R2R process. Fluorothermoplastics are low cost imprint stamp materials with great mechanical strength and chemical compatibility but with low gas permeability that trap air bubbles in the photopolymer during the imprint process. This paper describes the strategy for increasing gas permeability of fluorothermoplastics by introducing voids or pores in the stamp material by fabricating the stamps with aqueous colloidal dispersions of tetrafluoroethylene–hexafluoropropylene copolymer (FEP) nanoparticles. The basic idea is that the hard fluorinated particles, whose modulus is too high to deform during drying, remain as hard spheres and lead to a porous packing when drying is complete. The selection of suitable additives to eliminate cracks created by capillary stresses during water evaporation is also described in this paper.

77.3: Invited Paper: Roll‐to‐Roll Manufacturing of Backplanes for Paper‐Like Displays

HP and Phicot are planning the worlds first R2R (roll-to-roll) manufacturing line for display backplanes based on the SAIL (Self-Aligned Imprint Lithography) process. Economic benefits for R2R compared to batch, cost comparisons of different R2R processes, comparison of substrate options, and necessary supply chain infrastructure developments are presented.