Chang-hoon Lee

Fine pitch COG interconnections using anisotropically conductive adhesives

Chip-on-glass (COG) assembly technology using anisotropically conductive adhesives (ACAs) is being developed to achieve fine pitch interconnections between driver ICs and flat panel displays. The reliability of a UV curable anisotropically conductive adhesive (ACA) has been demonstrated and a prototype display has been built. Interconnection pitches were 130 micron. Furthermore, a method is proposed to achieve fine pitch COG interconnections of less than 50 micron pitch.