Chi-Wen Chen

Influence of Nanocrystals on Resistive Switching Characteristic in Binary Metal Oxides Memory Devices

The resistive random access memory has attracted much attention for nonvolatile memory application in recent years. However, there is an issue about variations of switching parameters such as set voltage and conductivity of resistance state in resistive switching memory. The variations may cause not only switching error but also reading error during operation. We investigated the switching performance of binary metal oxide as a resistive switching layer embedded with and without metal nanocrystals. Compared with the conventional memory structure, the memory embedded with metal nanocrystals shows better stability, preferable uniformity for the next generation nonvolatile memory application.

High-performance hydrogenated amorphous-Si TFT for AMLCD and AMOLED applications

A novel technology for manufacturing high-performance hydrogenated amorphous silicon (a-Si:H) thin-film transistors (TFTs) is developed in this letter. In the bottom gate light-shield a-Si:H TFT structure, the side edge of a-Si:H island is capped with extra deposition of heavily phosphorous-doped a-Si layer. Such an ingenuity can effectively eliminate the leakage path between the parasitic contacts of source/drain metal and the sidewall of a-Si:H island edge. In addition, electrical performance of the novel a-Si:H TFT device exhibits superior effective carrier mobility as high as 1.05 cm/sup 2//Vs, due to the enormous improvement in parasitic resistance. The impressively high performance of the proposed a-Si:H TFT provides the potential to apply foractive matrix liquid crystal display and active matrix organic light-emitting diode technology.

Enhancing the resistance of low-k hydrogen silsesquioxane (HSQ) to wet stripper damage

Abstract The interaction between low-k hydrogen silsesquioxane (HSQ) film and wet stripper was investigated. The wet stripper has been commonly used to remove photoresister in IC integration processing. However, the high content of alkalinity in the stripper solution often leads to the hydrolysis of HSQ film, forming dangling bonds in the HSQ. The dangling bonds in the HSQ film can easily react with hydroxide ion (OH−) in wet stripper solution and form Si–OH bonds. The resultant HSQ film will tend to uptake water and consequently increase both the leakage current and dielectric constant. In this study, H2-plasma pre-treatment was applied to the HSQ film. The hydrogen plasma treatment passivates the HSQ surface and prevent HSQ from water uptake during photoresist stripping. Therefore, dielectric degradation can be avoided with the H2-plasma pre-treatment.

Effectiveness of NH3 Plasma Treatment in Preventing Wet Stripper Damage to Low-K Hydrogen Silsesquioxane (HSQ)

Wet stripper is commonly used to remove photoresist in IC integration processing. However, the high alkalinity of the wet stripper solution often leads to the hydrolysis of hydrogen silsesquioxane (HSQ) film and induces water uptake. As a result, both the leakage current and dielectric constant of HSQ increase. In this study, NH3 plasma treatment was applied to the HSQ film to form a thin nitrogen-containing layer on the HSQ surface and prevents the hydrolysis of HSQ during photoresist stripping. Dielectric degradation can be prevented by NH3 plasma treatment.

P‐15: Highly Reliable Amorphous Si TFT with Low Leakage for AMLCD and AMOLED Applications

A novel technology for manufacturing high-performance hydrogenated amorphous silicon (a-Si:H) TFT is developed in this work. In the bottom gate light-shied a-Si:H TFT structure, the side edge of a-Si:H island is capped with extra deposition of heavily phosphorous-doped a-Si layer. Such an ingenuity can effectively eliminate the leakage path between the parasitic contacts between source/drain metal and a-Si:H at the edge of a-Si:H island. In addition, electrical performance of the novel a-Si:H TFT device exhibits superior effective carrier mobility, as high as 1.05 cm2/Vsec due to the enormous improvement in parasitic resistance. The impressively high performance provides the potential of our proposed a-Si:H TFT to apply for AMLCD and AMOLED technology.