Chien-Hsueh Shih

Copper interconnection with conductive polymer layer and method of forming the same

Process for improving copper line cap formation

Semiconductor interconnection structure and method for making the same

Transitional Interface between metal and dielectric in interconnect structures

Copper interconnect structures and fabrication method thereof

Chemical structures and compositions of ECP additives to reduce pit defects

Salicidation process using electroless plating to deposit metal and introduce dopant impurities

Silicide structure for ultra-shallow junction for MOS devices

ECP polymer additives and method for reducing overburden and defects

Uniform passivation method for conductive features