Shrikar Bhagath

Integrated circuit package having stacked integrated circuits and method therefor

SEMICONDUCTOR DIE STACK HAVING HEIGHTENED CONTACT FOR WIRE BOND

Leadframe based flash memory cards

Method of manufacturing flash memory cards

METHOD OF DIE STACKING USING INSULATED WIRE BONDS

System-in-a-package based flash memory card

Method of reducing warpage in an over-molded IC package

TEST PADS ON FLASH MEMORY CARDS

METHOD OF MAKING A SEMICONDUCTOR DEVICE HAVING MULTIPLE DIE REDISTRIBUTION LAYER

METHOD OF FABRICATING STACKED SEMICONDUCTOR PACKAGE WITH LOCALIZED CAVITIES FOR WIRE BONDING