Chin Hui Chong

Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices

Slanted vias for electrical circuits on circuit boards and other substrates

Microelectronic packages with leadframes, including leadframes configured for stacked die packages, and associated systems and methods

Metal core foldover package structures, systems including same and methods of fabrication

Methods for packaging microelectronic devices and microelectronic devices formed using such methods

Interconnecting substrates for microelectronic dies, methods for forming vias in such substrates, and methods for packaging microelectronic devices

Conductive vias having two or more conductive elements for providing electrical communication between traces in different planes in a substrate, semiconductor device assemblies including such vias, and accompanying methods

Semiconductor device assemblies and systems including at least one conductive pathway extending around a side of at least one semiconductor device