Lee Choon Kuan

Conductive vias having two or more conductive elements for providing electrical communication between traces in different planes in a substrate, semiconductor device assemblies including such vias, and accompanying methods

Electronic devices including conductive vias having two or more conductive elements for providing electrical communication between traces in different planes in a substrate, and accompanying methods

UPGRADEABLE AND REPAIRABLE SEMICONDUCTOR PACKAGES AND METHODS

Land grid array semiconductor device packages, assemblies including same, and methods of fabrication

Semiconductor device packages and assemblies

Lead frame-based semiconductor device packages incorporating at least one land grid array package and methods of fabrication

Land grid array semiconductor device packages

Carrierless chip package for integrated circuit devices, and methods of making same

BOARD-ON-CHIP TYPE SUBSTRATES WITH CONDUCTIVE TRACES IN MULTIPLE PLANES, SEMICONDUCTOR DEVICE PACKAGES INCLUDING SUCH SUBSTRATES, AND ASSOCIATED METHODS

Verkapselung für einen trägerlosen chip für integrierte schaltungen und herstellungsverfahren dafür