David J. Corisis

Stackable ball grid array package

Stacked mass storage flash memory package

Apparatus and methods of packaging and testing die

Stackable ceramic FBGA for high thermal applications

Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices

Stacked microelectronic dies and methods for stacking microelectronic dies

Semiconductor package having downset leadframe for reducing package bow

Multi-part lead frame with dissimilar materials and method of manufacturing

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

Leads under chip in conventional IC package