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David J. Corisis

Micron Technology

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Publication

Featured researches published by David J. Corisis.

Archive | 2001

Stackable ball grid array package

David J. Corisis; Jerry M. Brooks; Walter L. Moden

Archive | 2001

Stacked mass storage flash memory package

Leonard E. Mess; Jerry M. Brooks; David J. Corisis

Archive | 2001

Apparatus and methods of packaging and testing die

Leonard E. Mess; David J. Corisis; Walter L. Moden; Larry D. Kinsman

Archive | 2007

Stackable ceramic FBGA for high thermal applications

Walter L. Moden; David J. Corisis; Leonard E. Mess; Larry D. Kinsman

Archive | 2010

Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices

David J. Corisis; Chin Hui Chong; Choon Kuan Lee

Archive | 2000

Stacked microelectronic dies and methods for stacking microelectronic dies

David J. Corisis

Archive | 2000

Semiconductor package having downset leadframe for reducing package bow

David J. Corisis

Archive | 2002

Multi-part lead frame with dissimilar materials and method of manufacturing

S. Derek Hinkle; Jerry M. Brooks; David J. Corisis

Archive | 2010

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

Choon Kuan Lee; Chin Hui Chong; David J. Corisis

Archive | 2001

Leads under chip in conventional IC package

David J. Corisis

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Chin Hui Chong

Micron Technology

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Choon Kuan Lee

Micron Technology

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Jerry M. Brooks

Micron Technology

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Larry D. Kinsman

Micron Technology

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Walter L. Moden

Micron Technology

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Lee Choon Kuan

Micron Technology

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Tracy V. Reynolds

Micron Technology

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Chong Chin Hui

Micron Technology

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Leonard E. Mess

Micron Technology

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Matt E. Schwab

Micron Technology

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