Chong Chin Hui

UPGRADEABLE AND REPAIRABLE SEMICONDUCTOR PACKAGES AND METHODS

Semiconductor device packages and assemblies

Packaged ic device comprising an embedded flex circuit, and methods of making same

SEMICONDUCTOR DEVICE PACKAGES INCLUDING A SEMICONDUCTOR DEVICE AND A REDISTRIBUTION ELEMENT

Carrierless chip package for integrated circuit devices, and methods of making same

INTERPOSER STRUCTURE WITH EMBEDDED CAPACITOR STRUCTURE, AND METHODS OF MAKING SAME

Redistribution elements and semiconductor device packages including semiconductor devices and redistribution elements

METHODS OF FORMING SEMICONDUCTOR DEVICE PACKAGES INCLUDING A SEMICONDUCTOR DEVICE AND A REDISTRIBUTION ELEMENT, METHODS OF FORMING REDISTRIBUTION ELEMENTS AND METHODS FOR PACKAGING SEMICONDUCTOR DEVICES

BOARD-ON-CHIP TYPE SUBSTRATES WITH CONDUCTIVE TRACES IN MULTIPLE PLANES, SEMICONDUCTOR DEVICE PACKAGES INCLUDING SUCH SUBSTRATES, AND ASSOCIATED METHODS

PACKAGED IC DEVICE COMPRISING AN EMBEDDED FLEX CIRCUIT, AND METHODS OF MAKING THE SAME