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Christian Stümpfl

Rolf C. Hagen Group

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Publication

Featured researches published by Christian Stümpfl.

Archive | 2002

Electronic component with at least two stacked semiconductor chips and method for fabricating the electronic component

Bernd Goller; Gerald Ofner; Josef Thumbs; Holger Wörner; Robert-Christian Hagen; Christian Stümpfl; Stefan Wein

Archive | 2002

Electronic component and process for producing the electronic component

Bernd Goller; Robert-Christian Hagen; Gerald Ofner; Christian Stümpfl; Josef Thumbs; Stefan Wein; Holger Wörner

Archive | 2002

Electronic component with at least two stacked semiconductor chips, and fabrication method

Bernd Goller; Gerald Ofner; Josef Thumbs; Holger Wörner; Robert-Christian Hagen; Christian Stümpfl; Stefan Wein

Archive | 2001

Verfahren zur Herstellung eines elektronischen Bauteils mit einem Kuststoffgehäuse und elektronisches Bauteil

Bernd Goller; Robert Hagen; Gerald Ofner; Christian Stümpfl; Josef Thumbs; Stefan Wein; Holger Wörner

Archive | 2002

Elektronisches Bauteil als Multichipmodul und Verfahren zu dessen Herstellung

Bernd Goller; Robert-Christian Hagen; Christian Stümpfl; Stefan Wein; Holger Wörner

Archive | 2005

Semi-conductor component provided with through contacts which pass through plastic housing material and method for the production thereof

Michael Bauer; Thomas Bemmerl; Edward Fürgut; Simon Jerebic; Christian Stümpfl; Horst Theuss; Hermann Vilsmeier

Archive | 2003

Universal housing for an electronic semiconductor device and method of its manufacture

Bernd Goller; Robert-Christian Hagen; Gerald Ofner; Christian Stümpfl; Stefan Wein; Holger Wörner

Archive | 2001

Verfahren zur Herstellung eines elektronischen Bauteils

Horst Gröninger; Gerald Ofner; Christian Stümpfl

Archive | 2006

Herstellungsverfahren für eine elektronische Schaltung in einer Package-on-Package-Konfiguration und elektronisches Bauelement in einer solchen Konfiguration

Michael Bauer; Ludwig Heitzer; Jens Pohl; Peter Strobel; Christian Stümpfl

Archive | 2006

Production method for an electronic device and component in VQFN construction

Michael Bauer; Ludwig Heitzer; Christian Stümpfl

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Collaboration

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Michael Bauer

Infineon Technologies

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Gerald Ofner

Infineon Technologies

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Ludwig Heitzer

Infineon Technologies

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Jens Pohl

Siemens

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Hermann Vilsmeier

Infineon Technologies

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Peter Strobel

Infineon Technologies

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Bernd Römer

Infineon Technologies

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Bernhard Schätzler

Infineon Technologies

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Bernhard Zuhr

Infineon Technologies

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Josef Thumbs

Infineon Technologies

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