Chung-Hsien Lin | Researchain

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Featured researches published by Chung-Hsien Lin.

international conference on solid-state sensors, actuators and microsystems | 2011

MEMS technology development and manufacturing in a CMOS foundry

Cm Liu; Bruce C. S. Chou; Robert Chin-Fu Tsai; Nick Y.M. Shen; Benior Sf Chen; Emerson Cheng; Hsiao Chin Tuan; Alex Kalnitsky; Sean Cheng; Chung-Hsien Lin; Tien-Kan Chung; Kuei-Sung Chang; Yi-Shao Liu

MEMS technology development and MEMS manufacturing activities at TSMC are presented. Two models for process development, i.e. customer product/process “phase-in” and internally developed “platform” are discussed. The latter is a TSMC-MEMS platform for motion sensors and other devices.

ieee sensors | 2012

Bulk-Si with poly bump process scheme for MEMS sensors

Chun-Wen Cheng; Kai-Chih Liang; Chia-Hua Chu; Te-Hao Lee; Jiou-Kang Lee; Chung-Hsien Lin; Hsiao Chin Tuan; Alex Kalnitsky; Weileun Fang; David A. Horsley

A MEMS process scheme designed for multi- sensors is presented. This new process scheme includes a poly bump not only provides stiction prevention and gap control function, and also electrical connection between MEMS structure and routing lines. Another advantage for this scheme is a better vacuum level because all material can be high temperature annealed before final encapsulation. This study also demonstrated some MEMS devices using this new scheme, including resonators, accelerometers and magnetometers.

Archive | 2015