Craig A. Cabelli

Detectors for the James Webb Space Telescope Near‐Infrared Spectrograph. I. Readout Mode, Noise Model, and Calibration Considerations

We describe how the James Webb Space Telescope (JWST) Near-Infrared Spectrographs (NIRSpec) detectors will be read out, and present a model of how noise scales with the number of multiple nondestructive reads sampling up the ramp. We believe that this noise model, which is validated using real and simulated test data, is applicable to most astronomical near-infrared instruments. We describe some nonideal behaviors that have been observed in engineering-grade NIRSpec detectors, and demonstrate that they are unlikely to affect NIRSpec sensitivity, operations, or calibration. These include a HAWAII-2RG reset anomaly and random telegraph noise (RTN). Using real test data, we show that the reset anomaly is (1) very nearly noiseless and (2) can be easily calibrated out. Likewise, we show that large-amplitude RTN affects only a small and fixed population of pixels. It can therefore be tracked using standard pixel operability maps.

H2RG focal plane array and camera performance update

Teledyne’s H2RG focal plane arrays have been widely used in scientific infrared and visible instruments for ground-based and space-based telescopes. The majority of applications use the H2RG with 2.5 micron cutoff HgCdTe detector pixel at an operating temperature of ~77 K (LN2). The exceptionally low dark current of the 2.5 micron H2RG allows for operation at higher temperatures which facilitates simplified instrument designs and therefore lower instrument cost. Performance data of 2.5 micron H2RG arrays at 77K, 100 K, and 120 K are presented and are discussed as a function of detector bias and pixel readout rate. This paper also presents performance data of 1.75 micron and 5.3 micron H2RG focal plane arrays and discusses some of the inherent performance differences compared to 2.5 micron cutoff arrays. A complete infrared camera system that uses the H2RG focal plane array and SIDECAR ASIC focal plane electronics is introduced.

Detector arrays for the James Webb Space Telescope near-infrared spectrograph

The James Webb Space Telescopes (JWST) Near Infrared Spectrograph (NIRSpec) incorporates two 5 μm cutoff (λco =5 μm) 2048×2048 pixel Teledyne HgCdTe HAWAII-2RG sensor chip assemblies. These detector arrays, and the two Teledyne SIDECAR application specific integrated circuits that control them, are operated in space at T ~ 37 K. In this article, we provide a brief introduction to NIRSpec, its detector subsystem (DS), detector readout in the space radiation environment, and present a snapshot of the developmental status of the NIRSpec DS as integration and testing of the engineering test unit begins.

2048x2048 HgCdTe focal plane arrays for astronomy applications

Rockwell is developing the worlds largest HgCdTe IR focal plane array (FPA) for astronomy and low background applications. The format of the device is a hybrid 2048 X 2048 with a unit cell size of 18 micrometers X 18 micrometers . SWIR detectors with a spectral response of 0.85 micrometers to 2.5 micrometers have been processed on liquid phase epitaxy (LPE) HgCdTe on sapphire substrates. The MWIR detectors with a spectral response of 0.4 micrometers to 5 micrometers will be processed on molecular beam epitaxy HgCdTe on CdZnTe substrates. The multiplexer has been designed and fabricated at Conexant. Room temperature probing shows that the device is functional with excellent yield. Novel hybrid fabrication techniques will be used to demonstrate the FPA. This HAWAII-2 device is based on the highly successful HAWAII 1024 X 1024 device and the performance will be similar. The ultimate performance expected from the array is: dark currents of < 0.01 3-/s, quantum efficiency of > 75 percent across the spectral band, and noise levels of < 3 e- for the SWIR and < 10 e- for the MWIR band using Fowler sampling. We expected to achieve these performance levels at 77K for the SWIR and > 40K for the MWIR band. The status of the 2048 X 2048 detector arrays and FPAs are discussed.

Latest results on HgCdTe 2048x2048 and silicon focal plane arrays

The worlds first 2048 X 2048 HgCdTe infrared focal plane array (FPA) has been developed by Rockwell Science Center for infrared astronomy. The Hawaii-2 is the largest CMOS multiplexer designed to date, developed to interface with both infrared and visible detector arrays. The 18 micrometer pixel pitch was selected to accommodate both reasonable telescope optics and maximize yield in the fabrication of such a large readout. The fabrication uses world-class submicron photolithography to maximize yield of high quality devices. We will report on the characterization of FPAs using the Hawaii-2 multiplexer mated to SWIR detector arrays with a spectral response of 0.9 micrometer to 2.5 micrometer. These detector arrays have been processed on Liquid Phase Epitaxy (LPE) HgCdTe on sapphire substrates, also known as PACE-1. We also report on characterization of Silicon detectors in terms of their quantum efficiency, spectral response, and dark current.

Characterization of λc=5 μm Hg:Cd:Te arrays for low-background astronomy

Hg:Cd:Te grown by Molecular Beam Epitaxy onto a lattice matched Cd:Zn:Te substrate with Double Layer Planar Heterostructure architecture holds promise of extremely low, near theoretical dark current out to wavelengths beyond 5 micrometers while eliminating the persistent images and reduced short-wave quantum efficiency disadvantages of the liquid phase epitaxial (LPE) material now in widespread astronomical use. We report on the characterization of two Rockwell FPAs consisting of (lambda) c approximately 4.75 micrometers MBE material hybridized to 1K by 1K HAWAII multiplexers within the context of establishing their performance relative to the stringent focal plane goals for the Next Generation Space Telescope (NGST). The effort has concentrated primarily on characterizing total FPA noise at selected temperatures from 30 to 90 K although short wave quantum efficiency and image persistence have also been measured. The test procedures are based on the use of both DC and variance nosie techniques and, at T approximately 60K, have allowed characterization of the total noise as the sum of separate contributions due to dark current, read noise and read charge. The test facility and characterization techniques are described and results, which verify the remarkable potential of this material to exceed the NGST performance goals at temperatures both at, and also significantly higher than, the approximate 30K now anticipated for the NGST NIR focal pane, are presented.

Visible and infrared detectors at Rockwell Science Center

Rockwell Space Center is developing low-noise visible and IR imaging sensors and systems for astronomy, high-end commercial, NASA, and advanced military applications. The first science grade 2048 by 2048 HAWAII-2 focal plane array (FPA) for astronomy was recently demonstrated for the SWIR waveband. Science-grade deliveries to the University of Hawaiis Institute for Astronomy, the European Southern Observatory and the Subaru Telescope, among others, will soon start. MWIR/visible 2048 by 2048 HAWAII-2 arrays are also being developed for the NGST program using our process for removing the CdZnTe substrate from the back-side illuminated HgCdTe FPAs to detect visible radiation in addition to IR. Previously, more than 25 science grade 2.5micrometers 1024 by 1024 HAWAII FPAs were delivered for use in many observatories; these typically exhibit < 0.1 e-/s dark current and < 10 e- read noise after correlated double sampling at temperatures above 60K. 1024 by 1024 FPAs development is also continuing; dark current < 1 e-/s has been measured at 140K for a NIR 1024 by 1024 HAWAII array. In a related effort, development of high frame rate, low noise FPAs has begun for wavefront sensing including adaptive optical systems for both visible and NIR/SWIR bands. Hybrid Visible Silicon Imager development is also continuing, expanding the success achieved with prior 640 by 480 FPAs. We are now demonstrating 1024 by 1024 arrays with 0.3-1.05 micrometers response. The silicon detectors in HyViSI FPAs are independently processed on silicon wafers and mated to the same multiplexers fabricated originally for interface to HgCdTe detectors. HyViSI FPA quantum efficiency is > 90 percent with near-100 percent fill factor, and the dark current is negligible with minimum cooling. Our near-term plan to develop 4096 by 4096 visible and IR FPAs will also be discussed.

HgCdTe 20482 FPA for infrared astronomy: development status

The HAWAII-2 is an IR 20482 focal plane array (FPA) that is being developed for next-generation IR astronomy. It will supplant our HAWAII 10242 as the largest high- performance imaging array available for IR astronomy. As with our prior IR sensor, the flip-chip hybrid will consist of a low-capacitance HgCdTe detector array mated to a low- noise CMOS silicon multiplexer via indium interconnects. In order to accommodate reasonable telescope optics and fabrication of the large sophisticated readout using world- class submicron CMOS, the FPA has 18 micrometers pixel pitch. We anticipate > 5 percent yield of defect-free multiplexers using 0.8 micrometers CMOS. The HgCdTe detector arrays will be fabricated on large wafers including sapphire and silicon. Though the first FPAs will have 2.5 micrometers cut-off, the readout will be able to support longer wavelengths. Also reported are the latest 1024 X 1024 FPA results with 2.5 micrometers HgCdTe detectors.

Advanced imaging sensors at Rockwell Scientific Company

The past 2 to 3 years has been a period of explosive growth in technology development for imaging sensors at Rockwell Scientific Co. (RSC). The state of the art has been advanced significantly, resulting in a number of unique advanced imaging sensor products. A few key examples are: 2048 x 2048 sensor chip assemblies (SCA) for ground and space-based applications, 4096 x 4096 mosaic close-butted mosaic FPA assemblies, a very high performance 10 x 1024 hybridized linear SCA for optical network monitoring and other applications, the revolutionary CMOS ProCam-HD imaging system-on-a-chip for high definition television (HDTV), and RSCs near-infrared emission microscope camera for VLSI defect detection/analysis. This paper provides selected updates of these products and thereby provides an overview of the ongoing highly fertile period of technology and product development at Rockwell Scientific. A view into future directions for advanced imaging sensors is also provided.

Characterization of the Detector Subsystem for the Near Infrared Spectrograph (NIRSpec) on the James Webb Space Telescope

We present interim results from the characterization test development for the Detector Subsystem of the Near-Infrared Spectrograph (NIRSpec). NIRSpec will be the primary near-infrared spectrograph on the James Webb Space Telescope (JWST). The Detector Subsystem consists of a Focal Plane Assembly containing two Teledyne HAWAII-2RG arrays, two Teledyne SIDECAR cryogenic application specific integrated circuits, and a warm Focal Plane Electronics box. The Detector Characterization Laboratory at NASAs Goddard Space Flight Center will perform the Detector Subsystem characterization tests. In this paper, we update the initial test results obtained with engineering grade components.