D. Gregušová

Investigation of trapping effects in AlGaN/GaN/Si field-effect transistors by frequency dependent capacitance and conductance analysis

We report on frequency dependent capacitance and conductance analysis of the AlGaN/GaN/Si heterostructure field-effect transistors (HFETs) and Al2O3/AlGaN/GaN/Si metal-oxide-semiconductor HFETs (MOSHFETs) in order to investigate the trap effects in these devices. The capacitance of the HFETs exhibits significantly higher frequency dispersion than that of the MOSHFETs. Two different types of traps were found from the conductance analysis on both types of devices, fast with the time constant τ≅(0.1–1) μs and slow with τ=8 ms. The density of trap states evaluated on the HFETs was DT≅2.5×1012 and up to 1013 cm−2 eV−1 for the fast and slow traps, respectively. Analysis of the MOSHFETs yielded only slightly lower DT of the fast traps (≅1.5×1012 cm−2 eV−1), but nearly two orders of magnitude lower density of slow traps (≤4×1011 cm−2 eV−1) than those of the HFETs. This indicates an effective passivation of slow surface related traps but less influence on fast (probably bulk related) trapping states by applying an...

Improved transport properties of Al2O3∕AlGaN∕GaN metal-oxide-semiconductor heterostructure field-effect transistor

The authors report on improved transport properties of Al2O3∕AlGaN∕GaN metal-oxide-semiconductor heterostructure field-effect transistors (MOSHFETs). It is found that the drift mobility in the MOSHFET structures with 4nm thick Al2O3 gate oxide is significantly higher than that in HFETs. The zero-bias mobilities are 1950 and 1630cm2∕Vs for the MOSHFET and HFET, respectively. An ∼40% increase of the saturation drain current in the MOSHFETs compared to the HFETs seems to be larger than expected from the passivation effects. The MOSHFET devices show a higher transconductance (with peak values of ∼115mS∕mm) than the HFETs (∼70mS∕mm). Analysis of the device performance indicates a decrease of the parasitic series resistance together with an enhancement of the effective velocity of the channel electrons in the MOSHFET devices.

Characterization of AlGaN/GaN metal-oxide-semiconductor field-effect transistors by frequency dependent conductance analysis

We report on the frequency dependent conductance measurements of AlGaN/GaN metal-oxide-semiconductor heterostructure field-effect transistors (MOSHFETs). The properties of the devices with as-deposited and annealed 9-nm-thick Al2O3 gate oxide were investigated. The trap density in the range of 1011 cm−2 eV−1 was evaluated for the nonannealed devices. However, the conductance versus frequency peaks were significantly broader than those expected from theory, which indicates a surface potential fluctuation due to nonuniformities in the oxide charge and interface traps. Additionally, the dependence of the trap state time constant on gate voltage showed a deviation from the expected exponential function. However, the annealed devices (680 °C, 5 min) yielded a slightly lower (∼75%) trap density. Moreover, the conductance versus frequency data and the time constant versus gate voltage dependence of the annealed devices were in full agreement with the theoretical ones. The results show that the frequency dependen...

AlGaN/GaN metal?oxide?semiconductor heterostructure field-effect transistors with 4 nm thick Al2O3 gate oxide

AlGaN/GaN metal?oxide?semiconductor heterostructure field-effect transistors (MOSHFETs) with 4 nm thick Al2O3 gate oxide were prepared and their performance was compared with that of AlGaN/GaN HFETs. The MOSHFETs yielded ~40% increase of the saturation drain current compared with the HFETs, which is larger than expected due to the gate oxide passivation. Despite a larger gate-channel separation in the MOSHFETs, a higher extrinsic transconductance than that of the HFETs was measured. The drift mobility of the MOSHFETs, evaluated on large-gate FET structures, was significantly higher than that of the HFETs. The zero-bias mobility for MOSHFETs and HFETs was 1950 cm2 V?1 s?1 and 1630 cm2 V?1 s?1, respectively. These features indicate an increase of the drift velocity and/or a decrease of the parasitic series resistance in the MOSHFETs. The current collapse, evaluated from pulsed I?V measurements, was highly suppressed in the MOSHFETs with 4 nm thick Al2O3 gate oxide. This result, together with the suppressed frequency dispersion of the capacitance, indicates that the density of traps in the Al2O3/AlGaN/GaN MOSHFETs was significantly reduced.

Investigation of trap effects in AlGaN∕GaN field-effect transistors by temperature dependent threshold voltage analysis

We report on a temperature dependent threshold voltage analysis of the AlGaN∕GaN heterostructure field-effect transistors (HFETs) and Al2O3∕AlGaN∕GaN metal-oxide-semiconductor HFETs (MOSHFETs) in order to investigate the trap effects in these devices. The threshold voltage of both types of devices decreases with increased ambient temperature up to 450°C. This indicates on donor traps to be present. The temperature induced threshold voltage shift is −1.6 and −8.5mV∕°C for the HFETs and MOSHFETs, respectively. A thermally activated energy level of ∼0.2eV is evaluated and attributed to the nitrogen vacancy in the AlGaN near surface. The trap density for the MOSHFETs is about two times higher than that for the HFETs. This might be due to the high-temperature treatment (∼600°C) of the MOSHFET structure during the gate insulator deposition.

Schottky-barrier normally off GaN/InAlN/AlN/GaN HEMT with selectively etched access region

A Schottky-barrier normally off InAlN-based high-electron-mobility transistor (HEMT) with selectively etched access regions, high off-state breakdown, and low gate leakage is presented. Metal-organic chemical vapor deposition-grown 1-nm InAlN/1-nm AlN barrier stack is capped with a 2-nm-thick undoped GaN creating a negative polarization charge at a GaN/InAlN heterojunction. Consequently, the gate effective barrier height is increased, and the gate leakage as well as the equilibrium carrier concentration in the channel is decreased. After removal of the GaN cap at access regions by using a highly selective dry process, the extrinsic channel becomes populated by carriers. Normally off HEMTs with 8-μm source-to-drain distance and 1.8-μm -long symmetrically placed gate showed a source drain current of about 140 mA/mm. The HEMT gate leakage at a drain voltage of 200 V and grounded gate is below 10-7 A/mm with a three-terminal device breakdown of 255 V. The passivated InAlN surface potential has been calculated to be 1.45 V; significant drain current increase is predicted for even lower potential.

Impact of GaN cap on charges in Al2O3/(GaN/)AlGaN/GaN metal-oxide-semiconductor heterostructures analyzed by means of capacitance measurements and simulations

Oxide/semiconductor interface trap density (Dit) and net charge of Al2O3/(GaN)/AlGaN/GaN metal-oxide-semiconductor high-electron mobility transistor (MOS-HEMT) structures with and without GaN cap were comparatively analyzed using comprehensive capacitance measurements and simulations. Dit distribution was determined in full band gap of the barrier using combination of three complementary capacitance techniques. A remarkably higher Dit (∼5–8 × 1012 eV−1 cm−2) was found at trap energies ranging from EC-0.5 to 1 eV for structure with GaN cap compared to that (Dit ∼ 2–3 × 1012 eV−1 cm−2) where the GaN cap was selectively etched away. Dit distributions were then used for simulation of capacitance-voltage characteristics. A good agreement between experimental and simulated capacitance-voltage characteristics affected by interface traps suggests (i) that very high Dit (>1013 eV−1 cm−2) close to the barrier conduction band edge hampers accumulation of free electron in the barrier layer and (ii) the higher Dit cen...

RF Performance of InAlN/GaN HFETs and MOSHFETs With

The RF performance of lattice-matched InAlN/GaN heterostructure field-effect transistors (HFETs) and Al₂O₃/InAlN/GaN metal-oxide-semiconductor HFETs (MOSHFETs) with varied gate length was evaluated. The current gain cutoff frequency <i>fT</i> and the maximum oscillation frequency <i>f</i> _max for the HFETs with 0.3-μm gate length were 54 and 58 GHz, respectively. An increase of <i>fT</i> to 61 GHz and of<i>f</i> _max to 70 GHz was obtained for the MOSHFETs. The HFETs and MOSHFETs with different gate length yielded an <i>fT</i> × <i>LG</i> product of 18 and 21 GHz · μm, respectively. These are higher values than reported yet on InAlN/GaN devices and similar to those known for AlGaN/GaN HFETs.

f_{T} \times L_{G}

The trapping phenomena in GaN metal-oxide-semiconductor high-electron mobility transistor structures with 10 and 20-nm thick Al2O3 gate dielectric grown by metal-organic chemical vapor deposition were deeply investigated using comprehensive capacitance-voltage measurements. By controlling the interface traps population, substantial electron trapping in the dielectric bulk was identified. Separation between the trapping process and the interface traps emission allowed us to determine distribution of interface trap density in a wide energy range. Temperature dependence of the trapping process indicates thermionic field emission of electrons from the gate into traps with a sheet density of ∼1013 cm−2, located a few nm below the gate.

up to 21

Frequency dependent conductance measurements at varied temperature between 25 and 260 °C were performed to analyze trapping effects in the Al2O3/AlGaN/GaN metal-oxide-semiconductor heterostructure field-effect transistors. The trap states with a time constant τT,f≅(0.1–1) μs (fast) and τT,s=10 ms (slow) were identified. The conductance measurements at increased temperatures made it possible to evaluate the fast trap states in about a four times broader energy range than that from room temperature measurement. The density of the fast traps decreased from 1.4×1012 cm−2 eV−1 at an energy of 0.27 eV to about 3×1011 cm−2 eV−1 at ET=0.6 eV. The density of the slow traps was significantly higher than that of the fast traps, and it increased with increased temperature from about 3×1012 cm−2 eV−1 at 25–35 °C to 8×1013 cm−2 eV−1 at 260 °C.