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Featured researches published by Daeik Daniel Kim.


asian solid state circuits conference | 2008

Cell Broadband Engine performance and yield benchmark in 65nm SOI CMOS with spatial, temporal and parametric process variability model

Choongyeun Cho; Daeik Daniel Kim; Jonghae Kim

This paper introduces a process variability model to determine the performance and yield of the cell broadband engine (CBE) in 65 nm SOI CMOS. The model incorporates spatial (die-to-die), temporal (manufacturing process drift), and parametric dimensions, and provides microprocessor performance tracking and comprehensive view on the process variability with embedded ring oscillator measurement at the wafer level. It extracts CBE performance regularity within die for the circuit design and models, and reveals the semiconductor manufacturing signatures in wafers and lots for process technology. The model reduces performance estimation testing requirements by surpassing conventional methodspsila accuracy by 28%.


Archive | 2016

THREE DIMENSIONAL (3D) ANTENNA STRUCTURE

Daeik Daniel Kim; David Francis Berdy; Mario Francisco Velez; Chengjie Zuo; Changhan Hobie Yun; Jonghae Kim


Archive | 2014

Diplexer design using through glass via technology

Chengjie Zuo; Jonghae Kim; Mario Francisco Velez; Je-Hsiung Lan; Daeik Daniel Kim; Changhan Yun; David Francis Berdy; Robert Paul Mikulka; Matthew Michael Nowak; Xiangdong Zhang; Puay H. See


Archive | 2014

MULTI SPIRAL INDUCTOR

Daeik Daniel Kim; Jonghae Kim; Changhan Hobie Yun; Mario Francisco Velez; Chengjie Zuo


Archive | 2014

High density, low loss 3-d through-glass inductor with magnetic core

David Francis Berdy; Jonghae Kim; Chengjie Zuo; Daeik Daniel Kim; Changhan Hobie Yun; Mario Francisco Velez; Je-Hsiung Jeffrey Lan


Archive | 2013

SENSE AMPLIFIER OFFSET VOLTAGE REDUCTION

Jung Pill Kim; Taehyun Kim; Sungryul Kim; Daeik Daniel Kim


Archive | 2013

Systems for reducing magnetic coupling in integrated circuits (ics), and related components and methods

Chengjie Zuo; Jonghae Kim; Daeik Daniel Kim; Mario Francisco Velez; Changhan Hobie Yun; Je-Hsiung Jeffrey Lan; Robert Paul Mikulka; Matthew Michael Nowak


Archive | 2014

CAPACITOR WITH A DIELECTRIC BETWEEN A VIA AND A PLATE OF THE CAPACITOR

Je-Hsiung Lan; Chengjie Zuo; Changhan Yun; David Francis Berdy; Daeik Daniel Kim; Robert Paul Mikulka; Mario Francisco Velez; Jonghae Kim


Archive | 2013

Connector placement for a substrate integrated with a toroidal inductor

Daeik Daniel Kim; Young Kyu Song; Mario Francisco Velez; Jonghae Kim; Changhan Hobie Yun; Chengjie Zuo; Xiaonan Zhang; Ryan David Lane; Matthew Michael Nowak


Archive | 2014

PACKAGE ON PACKAGE (PoP) INTEGRATED DEVICE COMPRISING A CAPACITOR IN A SUBSTRATE

Jong-Hoon Lee; Young Kyu Song; Daeik Daniel Kim; Jung Ho Yoon; Uei-Ming Jow; Mario Francisco Velez; Jonghae Kim; Xiaonan Zhang; Ryan David Lane

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