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Dive into the research topics where Robert Paul Mikulka is active.

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Featured researches published by Robert Paul Mikulka.


international frequency control symposium | 2012

Cross-sectional dilation mode resonator with very high electromechanical coupling up to 10% using AlN

Chengjie Zuo; Changhan H. Yun; Philip Jason Stephanou; Sang-June Park; Chi-Shun T. Lo; Robert Paul Mikulka; Je-Hsiung J. Lan; Mario Francisco Velez; Ravindra V. Shenoy; Jonghae Kim; Matthew Michael Nowak

For the first time in the development of piezoelectric micromechanical resonators, this paper presents a new class of cross-sectional dilation mode resonators (XDMR) that achieve unprecedentedly high electromechanical coupling constant: kt2 up to 10% for aluminum nitride (AlN) based resonators and 19% for zinc oxide (ZnO) based resonators. Detailed discussions on the geometry design, FEM simulation, and process challenge are provided in this paper to give insight on this novel high-kt2 piezoelectric resonator technology and, more importantly, guide the future development of mechanical resonators with coherent 2D/3D mode shapes.


Archive | 2014

Diplexer design using through glass via technology

Chengjie Zuo; Jonghae Kim; Mario Francisco Velez; Je-Hsiung Lan; Daeik Daniel Kim; Changhan Yun; David Francis Berdy; Robert Paul Mikulka; Matthew Michael Nowak; Xiangdong Zhang; Puay H. See


Archive | 2013

Systems for reducing magnetic coupling in integrated circuits (ics), and related components and methods

Chengjie Zuo; Jonghae Kim; Daeik Daniel Kim; Mario Francisco Velez; Changhan Hobie Yun; Je-Hsiung Jeffrey Lan; Robert Paul Mikulka; Matthew Michael Nowak


Archive | 2014

CAPACITOR WITH A DIELECTRIC BETWEEN A VIA AND A PLATE OF THE CAPACITOR

Je-Hsiung Lan; Chengjie Zuo; Changhan Yun; David Francis Berdy; Daeik Daniel Kim; Robert Paul Mikulka; Mario Francisco Velez; Jonghae Kim


Archive | 2012

Complex passive design with special via implementation

Chi Shun Lo; Je-Hsiung Jeffrey Lan; Mario Francisco Velez; Robert Paul Mikulka; Chengjie Zuo; Changhan Hobie Yun; Jonghae Kim


Archive | 2015

FACE-UP SUBSTRATE INTEGRATION WITH SOLDER BALL CONNECTION IN SEMICONDUCTOR PACKAGE

Daeik Daniel Kim; Jonghae Kim; Chengjie Zuo; Changhan Hobie Yun; Mario Francisco Velez; Robert Paul Mikulka


Archive | 2014

Electronic device having asymmetrical through glass vias

Daeik Daniel Kim; David Francis Berdy; Chengjie Zuo; Mario Francisco Velez; Changhan Yun; Robert Paul Mikulka; Jonghae Kim; Je-Hsiung Lan


Archive | 2013

Tunable diplexers in three-dimensional (3d) integrated circuits (ic) (3dic) and related components and methods

Chengjie Zuo; Daeik Daniel Kim; Je-Hsiung Lan; Jonghae Kim; Mario Francisco Velez; Changhan Yun; David Francis Berdy; Robert Paul Mikulka; Matthew Michael Nowak; Xiangdong Zhang; Puay H. See


Archive | 2016

Superposed structure 3D orthogonal through substrate inductor

David Francis Berdy; Chengjie Zuo; Daeik Daniel Kim; Changhan Hobie Yun; Mario Francisco Velez; Robert Paul Mikulka; Jonghae Kim


Archive | 2014

DESIGN FOR HIGH PASS FILTERS AND LOW PASS FILTERS USING THROUGH GLASS VIA TECHNOLOGY

Chengjie Zuo; Jonghae Kim; Changhan Hobie Yun; Daeik Daniel Kim; Mario Francisco Velez; Je-Hsiung Lan; Robert Paul Mikulka; Matthew Michael Nowak

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