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Dive into the research topics where Daisuke Shiraishi is active.

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Featured researches published by Daisuke Shiraishi.


IEEE Transactions on Semiconductor Manufacturing | 2015

Correlational Study Between SiN Etch Rate and Plasma Impedance in Electron Cyclotron Resonance Plasma Etcher for Advanced Process Control

Takeshi Ohmori; Makoto Kashibe; Satoshi Une; Koichi Yamamoto; Daisuke Shiraishi; Satomi Inoue

The correlation between the change in the etching rate of SiN and the change in the monitored plasma impedance was investigated to estimate the capability of critical dimension (CD) prediction with a plasma impedance monitor (PIM). The results obtained with the PIM were compared with those of optical emission spectroscopy (OES), which was performed using the emission intensity ratio of C2/H, and showed that the SiN etching rate is strongly correlated with several values obtained with the PIM. We conclude that the PIM has the potential to predict CDs with the same accuracy as that of OES.


Archive | 2004

Method of monitoring and/or controlling a semiconductor manufacturing apparatus and a system therefor

Junichi Tanaka; Hiroyuki Kitsunai; Akira Kagoshima; Daisuke Shiraishi; Hideyuki Yamamoto; Shoji Ikuhara; Toshio Masuda


Archive | 2002

Etching system and etching method

Akira Kagoshima; Motohiko Yoshigai; Hideyuki Yamamoto; Daisuke Shiraishi; Junichi Tanaka; Kenji Tamaki; Natsuyo Morioka


Archive | 2009

Etching apparatus, analysis apparatus, etching treatment method, and etching treatment program

Toshihiro Morisawa; Daisuke Shiraishi; Satomi Inoue


Archive | 2000

Plasma etching method, manufacturing of electronic device, plasma etching device and plasma processor

Hiromitsu Enami; Akira Kagoshima; Shigeru Masuda; Natsuyo Morioka; Daisuke Shiraishi; 茂 増田; なつよ 森岡; 弘充 榎並; 大輔 白石; 昭 鹿子嶋


Archive | 2006

Etching apparatus, method for measuring self-bias voltage, and method for monitoring etching apparatus

Shoji Ikuhara; Hideyuki Yamamoto; Daisuke Shiraishi; Akira Kagoshima


Archive | 2003

Semiconductor plasma processing apparatus with first and second processing state monitoring units

Junichi Tanaka; Hiroyuki Kitsunai; Akira Kagoshima; Daisuke Shiraishi; Hideyuki Yamamoto; Shoji Ikuhara; Toshio Masuda


Archive | 2003

Method and apparatus for processing semiconductor

Junichi Tanaka; Hiroyuki Kitsunai; Hideyuki Yamamoto; Akira Kagoshima; Daisuke Shiraishi


Archive | 2009

Etching process state judgment method and system therefor

Toshihiro Morisawa; Shoji Ikuhara; Akira Kagoshima; Daisuke Shiraishi


Archive | 2009

ETCHING ENDPOINT DETERMINATION METHOD

Hiroshige Uchida; Daisuke Shiraishi; Shoji Ikuhara; Akira Kagoshima

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