Damien Lambert

Large-scale photonic integrated circuits

We present an overview of Infineras current generation of 100 Gb/s transmitter and receiver PICs as well as results from the next-generation 500 Gb/s PM-QPSK PICs.

Current Status of Large-Scale InP Photonic Integrated Circuits

In this paper, the current state of the art for large-scale InP photonic integrated circuits (PICs) is reviewed with a focus on the devices and technologies that are driving the commercial scaling of highly integrated devices. Specifically, the performance, reliability, and manufacturability of commercial 100-Gb/s dense wavelength-division-multiplexed transmitter and receiver PICs are reviewed as well as next- and future-generation devices (500 Gb/s and beyond). The large-scale PIC enables significant reductions in cost, packaging complexity, size, fiber coupling, and power consumption which have enabled benefits at the component and system level.

Large-Scale InP Transmitter PICs for PM-DQPSK Fiber Transmission Systems

We report here the first demonstration of a large-scale monolithically integrated InP-based 10-channel 45.6-Gb/s per channel transmitter photonic integrated circuit employing polarization-multiplexed differential quadrature phase-shift keying modulation format.

Large-scale photonic integrated circuits for long-haul transmission and switching

Feature Issue on Nanoscale Integrated Photonics for Optical Networks Dense wavelength division multiplexed (DWDM) large-scale, single-chip transmitter and receiver photonic integrated circuits (PICs), each capable of operating at 100 Gbits/s, have been deployed in the field since the end of 2004. These highly integrated InP chips have significantly changed the economics of long-haul optical transport networks. First, a review of the ten-channel, 100 Gbits/s PIC is presented. Then two extensions of the technology are demonstrated; first is wide temperature, coolerless operation of the 100 Gbits/s PIC, and second is a single integrated chip with 40 channels operating at 40 Gbits/s, capable of an aggregate data rate of 1.6 Tbits/s.

10 Channel, 100Gbit/s per channel, dual polarization, coherent QPSK, monolithic InP receiver photonic integrated circuit

A 10 channel, dual polarization, monolithically integrated, coherent QPSK receiver on InP operating at 100Gbit/s per channel is demonstrated.

Multi-channel coherent PM-QPSK InP transmitter photonic integrated circuit (PIC) operating at 112 Gb/s per wavelength

A 10-wavelength, polarization-multiplexed, monolithically integrated InP transmitter PIC is demonstrated for the first time to operate at 112 Gb/s per wavelength with a coherent receiver PIC.

10 Channel, 45.6 Gb/s per Channel, Polarization-Multiplexed DQPSK, InP Receiver Photonic Integrated Circuit

We demonstrate a 10 wavelength, 200 GHz spaced, monolithically integrated, polarization-multiplexed, InP differential quadrature phase shift keying receiver operating at 45.6 Gb/s per wavelength. The receiver is based on a novel technique for polarization demodulation and phase tracking that does not require any external components.

Terabit/s class InP photonic integrated circuits

In this paper, we review recent developments in the area of terabit/s?class monolithically integrated, transmitter and receiver photonic integrated circuits for the implementation of coherent, polarization-multiplexed, quadrature phase shift keying and higher order modulation formats.

From Visible Light-Emitting Diodes to Large-Scale III–V Photonic Integrated Circuits

The discovery of the visible light-emitting diode (LED) 50 years ago by Holonyak and Bevacqua and the associated demonstration of the viability of the III-V semiconductor alloy created a foundational basis for the field of optoelectronics. Key advances which enabled the progression from the first visible LED to todays III-V photonic integrated circuits (PICs) are described. Furthermore, the current state-of-the-art 500-Gb/s and 1-Tb/s large-scale InP transmitter and receiver PICs and their essential role in the optical communications networks are reviewed.

250Gb/s real-time PIC-based super-channel transmission over a gridless 6000km terrestrial link

A 250Gb/s super-channel using Photonic Integrated Circuits (PIC) was transmitted over 6000km along with a 500Gb/s super-channel and conventional 40Gb/s and 100Gb/s channels. The linear terrestrial line system uses FlexWSS multiplexing technologies and Hybrid RamanEDFA amplifiers.