Daniel J. Devine

The future of RTP, a technology that can change the IC fab industry

RTP presents a unique opportunity for the semiconductor industry. By completing the transition to RTP as we enter the 300 mm-era, the industry can seize the opportunity for significant improvements in cycle-time, in thermal budget minimization and in process performance. This paper examines how RTP has evolved to meet these challenges and describes the state-of-the-art of RTP technology today. The poor throughput performance of 300 mm batch furnaces, the risk of misprocessing large batches of very valuable wafers and the inflexibility of the furnace in an era when cycle-time is paramount all signal the end of large-batch thermal processing within this decade.