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Dive into the research topics where Daniel Namishia is active.

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Featured researches published by Daniel Namishia.


IEEE Electron Device Letters | 2011

High-Performance Implanted-Channel SiC MESFETs

Saptharishi Sriram; Alexander V. Suvorov; Jason Henning; Daniel Namishia; Helmut Hagleitner; Jeremy Fisher; Thomas Smith; Terry Alcorn; William T. Pulz

We demonstrate for the first time the development of state-of-the-art ion-implanted-channel SiC MESFETs with record dc and RF performance that is comparable to that of epitaxial-channel devices. MESFETs fabricated with this approach show a maximum stable gain exceeding 15.8 dB at 3.1 GHz in class-AB bias condition. An RF power output that is greater than 4 W/mm, with 63% drain efficiency, at 3.5 GHz was also achieved, showing the potential of these devices for high-power operation.


Archive | 2012

DEVICES WITH CRACK STOPS

Van Mieczkowski; Daniel Namishia


Archive | 2013

Ni-rich schottky contact

Helmut Hagleitner; Fabian Radulescu; Daniel Namishia


Archive | 2013

FLOATING BOND PAD FOR POWER SEMICONDUCTOR DEVICES

Sarah K. Haney; Brett Hull; Daniel Namishia


Archive | 2011

OHMIC CONTACT TO SEMICONDUCTOR DEVICE

Helmut Hagleitner; Daniel Namishia


Archive | 2013

ENCAPSULATION OF ADVANCED DEVICES USING NOVEL PECVD AND ALD SCHEMES

Zoltan Ring; Helmut Hagleitner; Daniel Namishia


Archive | 2015

STRESS MITIGATION FOR THIN AND THICK FILMS USED IN SEMICONDUCTOR CIRCUITRY

Zoltan Ring; Donald A. Gajewski; Scott T. Sheppard; Daniel Namishia


Archive | 2015

***WITHDRAWN PATENT AS PER THE LATEST USPTO WITHDRAWN LIST***Ohmic contact to semiconductor device

Helmut Hagleitner; Daniel Namishia


Archive | 2014

Bond pad arrangement for power semiconductor devices

Sarah K. Haney; Brett Hull; Daniel Namishia


Archive | 2014

Encapsulation de dispositif à semi-conducteurs à barrière multicouche par dépôt chimique en phase vapeur assisté par plasma ou dépôt de couches atomiques

Zoltan Ring; Helmut Hagleitner; Daniel Namishia

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