Daniel S. Vanslette | Researchain

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Featured researches published by Daniel S. Vanslette.

Archive | 2009

Simultaneously formed isolation trench and through-box contact for silicon-on-insulator technology

Alan B. Botula; BethAnn Rainey; Daniel S. Vanslette

Archive | 2009

Methods and structures for controlling wafer curvature

Mohammed Fazil Fayaz; Jeffery B. Maxson; Anthony K. Stamper; Daniel S. Vanslette

Archive | 2011

Structure with a metal silicide transparent conductive electrode and a method of forming the structure

Jeffrey P. Gambino; Derrick Liu; Daniel S. Vanslette

Meeting Abstracts | 2011

Stress Characterization of Tungsten-Filled through Silicon via Arrays Using Very High Resolution Multi-Wavelength Raman Spectroscopy

Jeff Gambino; Daniel S. Vanslette; Bucknell C. Webb; Cameron E. Luce; Takeshi Ueda; Toshikazu Ishigaki; Kitaek Kang; Woo Sik Yoo

Archive | 2014

Through silicon via wafer, contacts and design structures

Jeffrey P. Gambino; Cameron E. Luce; Daniel S. Vanslette; Bucknell C. Webb

Archive | 2009

Tungsten liner for aluminum-based electromigration resistant interconnect structure

Jonathan D. Chapple-Sokol; Daniel A. Delibac; He Zhong-Xiang; Tom C. Lee; William J. Murphy; Timothy D. Sullivan; David C. Thomas; Daniel S. Vanslette

Archive | 2001

Sputtered tungsten diffusion barrier for improved interconnect robustness

Stephen Bruce Brodsky; William J. Murphy; Matthew J. Rutten; David Craig Strippe; Daniel S. Vanslette

Archive | 2012

INTEGRATED STRUCTURES OF HIGH PERFORMANCE ACTIVE DEVICES AND PASSIVE DEVICES

Robert M. Rassel; Anthony K. Stamper; Daniel S. Vanslette

Archive | 2011

ELECTROMIGRATION RESISTANT ALUMINUM-BASED METAL INTERCONNECT STRUCTURE

Jonathan D. Chapple-Sokol; Daniel A. Delibac; Zhong-Xiang He; Tom C. Lee; William J. Murphy; Timothy D. Sullivan; David C. Thomas; Daniel S. Vanslette

Archive | 2002