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Dive into the research topics where David Alan Lilienfeld is active.

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Featured researches published by David Alan Lilienfeld.


Materials Science Forum | 2016

Readiness of SiC MOSFETs for Aerospace and Industrial Applications

Ljubisa Dragoljub Stevanovic; Peter Almern Losee; Stacey Joy Kennerly; Alexander Viktorovich Bolotnikov; Brian Rowden; Joseph Lucian Smolenski; Maja Harfman-Todorovic; Rajib Datta; Stephen Daley Arthur; David Alan Lilienfeld; Tobias Schuetz; Fabio Carastro; Feng Feng Tao; David Richard Esler; Ravi Raju; Greg Dunne; Philip Cioffi; Liang Chun Yu

This paper highlights ongoing efforts to validate performance, reliability and robustness of GE SiC MOSFETs for Aerospace and Industrial applications. After summarizing ruggedness and reliability testing performed on 1.2kV MOSFETs, two application examples are highlighted. The first demonstrates the 1.2kV device performance in a prototype high frequency 75kW Aviation motor drive. The second highlights the experimental demonstration of a 99% efficient 1.0MW solar inverter using 1.7kV MOSFET modules in a two-level topology switching at 8kHz. Both applications illustrate that SiC advantage is not only in improved performance, but also in significant system cost savings through simplifications in topology, controls, cooling and filtering.


Materials Science Forum | 2016

High Performance 1.2kV-2.5kV 4H-SiC MOSFETs with Excellent Process Capability and Robustness

Peter Almern Losee; Alexander Viktorovich Bolotnikov; Stacey Joy Kennerly; Christopher Collazo-Davila; David Alan Lilienfeld; Greg Dunne; Thomas Bert Gorczyca; Peter Deeb; James W. Kretchmer; David Richard Esler; Ljubisa Dragoljub Stevanovic

In this paper, we show state of the art, low on-resistance, 25mW/1.2kV and 43mW/2.5kV SiC MOSFETs with excellent design robustness and process control such that the parametric spread of key device characteristics are approaching Si products. The impact of starting material variability on device performance is shown and design sensitivity curves are presented.


Materials Science Forum | 2018

Fabrication of 2.5kV 4H-SiC PiN Diodes with High Energy Implantation (>12MeV) of Al+ and B+

Reza Ghandi; Peter Almern Losee; Alexander Viktorovich Bolotnikov; David Alan Lilienfeld

In this work, >2kV PiN diodes with >10um deep implant of B+ and 6um deep implant of Al+ have been fabricated to evaluate the quality of resulting pn junction after high-energy implantation. Acceptable low leakage currents at reverse bias and stable avalanche breakdown were observed for high energy implanted diodes (HEI-diodes) when compared to No-HEI-diodes that suggests minimal defect sites present after activation anneal.


Archive | 2012

SEMICONDUCTOR DEVICE AND METHOD FOR REDUCED BIAS THRESHOLD INSTABILITY

Stephen Daley Arthur; Joseph Darryl Michael; Tammy Lynn Johnson; David Alan Lilienfeld; Kevin Matocha; Jody Fronheiser; William Gregg Hawkins


Archive | 2013

DEVICE HAVING REDUCED BIAS TEMPERATURE INSTABILITY (BTI)

Joseph Darryl Michael; Stephen Daley Arthur; Tammy Lynn Johnson; David Alan Lilienfeld


Archive | 2012

Silicon carbide semiconductor device with a gate electrode

Stephen Daley Arthur; Tammy Lynn Johnson; Joseph Darryl Michael; Jody Fronheiser; David Alan Lilienfeld; Kevin Matocha; William Gregg Hawkins


Archive | 2017

Edge termination designs for silicon carbide super-junction power devices

Alexander Viktorovich Bolotnikov; Peter Almern Losee; David Alan Lilienfeld; James Jay Mcmahon


Archive | 2017

CONCEPTIONS DE TERMINAISON DE BORD POUR DISPOSITIFS DE PUISSANCE À SUPER-JONCTION AU CARBURE DE SILICIUM

Alexander Viktorovich Bolotnikov; Peter Almern Losee; David Alan Lilienfeld; James Jay Mcmahon


Archive | 2017

Active area designs for charge-balanced diodes

Reza Ghandi; Peter Almern Losee; Alexander Viktorovich Bolotnikov; David Alan Lilienfeld


Archive | 2017

SUPER-JUNCTION SEMICONDUCTOR POWER DEVICES WITH FAST SWITCHING CAPABILITY

Alexander Viktorovich Bolotnikov; Peter Almern Losee; David Alan Lilienfeld; Reza Ghandi

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