David F. Abdo

Method of packaging a semiconductor die

Method of packaging a semiconductor die and package thereof

Packaged semiconductor devices and methods of their fabrication

RF AMPLIFIER WITH CONDUCTOR-LESS REGION UNDERLYING FILTER CIRCUIT INDUCTOR, AND METHODS OF MANUFACTURE THEREOF

Providing an automatic optical inspection feature for solder joints on semiconductor packages

ENCAPSULATED SEMICONDUCTOR DEVICE PACKAGE WITH HEATSINK OPENING

ENCAPSULATED SEMICONDUCTOR DEVICE PACKAGE WITH HEATSINK OPENING, AND METHODS OF MANUFACTURE THEREOF

SEMICONDUCTOR DEVICE WITH AN ISOLATION STRUCTURE COUPLED TO A COVER OF THE SEMICONDUCTOR DEVICE

Semiconductor device with mechanical lock features between a semiconductor die and a substrate

DEVICES AND METHODS OF OPERATION FOR SEPARATING SEMICONDUCTOR DIE FROM ADHESIVE TAPE