David Nin-Kou Wang | Researchain

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Archive | 1988

REACTOR CHAMBER FOR SELFCLEANING PROCESS

Kam S. Law; Cissy Leung; Ching Cheong Tang; Kenneth S. Collins; Mei Chang; Jerry Yuen Kui Wong; David Nin-Kou Wang

Journal of The Electrochemical Society | 1982

Multiple‐Etchant Loading Effect and Silicon Etching in ClF3 and Related Mixtures

Daniel L. Flamm; David Nin-Kou Wang; Dan Maydan

Journal of The Electrochemical Society | 1975

Emf's across CdI2 ‐ Cd2 I 2 Electrolytes Using Electrodes of Bare W, Molten Cd, and Molten Au‐Cd: Bare Electrode Effects, Use of n ≠ 2 , Premonitory Phenomena and Liquid Structure in Au‐Cd, and the Cd ‐ CdX2 Phase Diagrams

David Nin-Kou Wang; Guy R. B. Elliott; Charles H. Pitt

Archive | 1993

Teos thermal cvd method

John A. Adamik; Kenneth S. Collins; Meidan Dan; S Raw Kam; Cissy Leung; Ilya Perlov; Salvador P. Umotoy; David Nin-Kou Wang; John M. White; パーロフイルヤ; エス．ロウカム; エスコリンズケニス; ピーウモトイサルヴァドル; リューンシシー; エイアダミクジョン; エムホワイトジョン; メイダンダン; ニンクーワンディヴィッド

Archive | 1993

Semiconductor-treating reactor

Archive | 1991

Vhf/uhf reaction apparatus

Kenneth S. Collins; Dan Maydan; Craig A. Roderick; David Nin-Kou Wang; Chan-Lon Yang

Archive | 1990

Verfahren zum Anbringen einer Wolframschicht auf einem Halbleiterplättchen A method of applying a tungsten layer on a semiconductor wafer

Mei Chang; Cissy Leung; David Nin-Kou Wang; David Cheng

Archive | 1990

Si etching residual removal method for device of very fine structure

Daniel L. Flamm; Dan Maydan; David Nin-Kou Wang

Archive | 1990

Multistep flattening chemical vapor deposition method

Dan Maydan; David Nin-Kou Wang

Archive | 1989

Vakuum-Bearbeitungsreaktor. A vacuum processing reactor.

David Cheng; Dan Maydan; Sasson Somekh; Kenneth R. Stalder; Dana Andrews; Mei Chang; John M. White; Jerry Yuen Kui Wong; Vladimir J. Zeitlin; David Nin-Kou Wang

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