Dimitra Ketzaki

Metamaterial-Based Design of Planar Compact MIMO Monopoles

A systematic design of planar MIMO monopole antennas with significantly reduced mutual coupling is presented, based on the concept of metamaterials. The design is performed by means of individual rectangular loop resonators, placed in the space between the antenna elements. The underlying principle is that resonators act like small metamaterial samples, thus providing an effective means of controlling electromagnetic wave propagation. The proposed design achieves considerably high levels of isolation between antenna elements, without essentially affecting the simplicity and planarity of the MIMO antenna.

Electromagnetically induced transparency with hybrid silicon-plasmonic traveling-wave resonators

Spectral filtering and electromagnetically induced transparency (EIT) with hybrid silicon-plasmonic traveling-wave resonators are theoretically investigated. The rigorous three-dimensional vector finite element method simulations are complemented with temporal coupled mode theory. We show that ring and disk resonators with sub-micron radii can efficiently filter the lightwave with minimal insertion loss and high quality factors (Q). It is shown that disk resonators feature reduced radiation losses and are thus advantageous. They exhibit unloaded quality factors as high as 1000 in the telecom spectral range, resulting in all-pass filtering components with sharp resonances. By cascading two slightly detuned resonators and providing an additional route for resonator interaction (i.e., a second bus waveguide), a response reminiscent of EIT is observed. The EIT transmission peak can be shaped by means of resonator detuning and interelement separation. Importantly, the respective Q can become higher than that o...

Beam Propagation Method Based on the Iterated Crank–Nicolson Scheme for Solving Large-Scale Wave Propagation Problems

An explicit vectorial beam propagation method, based on the iterated Crank-Nicolson scheme is developed and utilized to solve electromagnetic wave propagation problems in large-scale structures. A full wide-angle extension is studied, based on a direct calculation of the one-way differential operator only in the first propagation step, together with a fast modification along the propagation axis, to account for material and structure variations.

Aluminum plasmonic waveguides co-integrated with Si 3 N 4 photonics using CMOS processes

Co-integrating CMOS plasmonics and photonics became the “sweet spot” to hit in order to combine their benefits and allow for volume manufacturing of plasmo-photonic integrated circuits. Plasmonics can naturally interface photonics with electronics while offering strong mode confinement, enabling in this way on-chip data interconnects when tailored to single-mode waveguides, as well as high-sensitivity biosensors when exposing Surface-Plasmon-Polariton (SPP) modes in aqueous environment. Their synergy with low-loss photonics can tolerate the high plasmonic propagation losses in interconnect applications, offering at the same time a powerful portfolio of passive photonic functions towards avoiding the use of bulk optics for SPP excitation and facilitating compact biosensor setups. The co-integration roadmap has to proceed, however, over the utilization of fully CMOS compatible material platforms and manufacturing processes in order to allow for a practical deployment route. Herein, we demonstrate for the first time Aluminum plasmonic waveguides co-integrated with Si3N4 photonics using CMOS manufacturing processes. We validate the data carrying credentials of CMOS plasmonics with 25 Gb/s data traffic and we confirm successful plasmonic propagation in both air and water-cladded waveguide configurations. This platform can potentially fuel the deployment of co-integrated plasmonic and photonic structures using CMOS processes for biosensing and on-chip interconnect applications.

CMOS plasmonic waveguides co-integrated with LPCVD-based Si3N4 via a butt-coupled interface

Plasmonic technology has attracted intense research interest enhancing the functional portfolio of photonic integrated circuits (PICs) by providing Surface-Plasmon-Polariton (SPP) modes with ultra-high confinement at sub-wavelength scale dimensions and as such increased light matter interaction. However, in most cases plasmonic waveguides rely mainly on noble metals and exhibit high optical losses, impeding their employment in CMOS processes and their practical deployment in highly useful PICs. Hence, merging CMOS compatible plasmonic waveguides with low-loss photonics by judiciously interfacing these two waveguide platforms appears as the most promising route towards the rapid and costefficient manufacturing of high-performance plasmo-photonic integrated circuits. In this work, we present butt-coupled plasmo-photonic interfaces between CMOS compatible 7μm-wide Aluminum (Al) and Copper (Cu) metal stripes and 360×800nm Si3N4 waveguides. The interfaces have been designed by means of 3D FDTD and have been optimized for aqueous environment targeting their future employment in biosensing interferometric arrangements, with the photonic waveguides being cladded with 660nm of Low Temperature Oxide (LTO) and the plasmonic stripes being recessed in a cavity formed between the photonic waveguides. The geometrical parameters of the interface will be presented based on detailed simulation results, using experimentally verified plasmonic properties for the employed CMOS metals. Numerical simulations dictated a coupling efficiency of 53% and 68% at 1.55μm wavelength for Al and Cu, respectively, with the plasmonic propagation length Lspp equaling 66μm for Al and 75μm for Cu with water considered as the top cladding. The proposed interface configuration is currently being fabricated for experimental verification.

Efficient coupling between Si3N4 photonic and hybrid slot-based CMOS plasmonic waveguide

Bringing photonics and electronics into a common integration platform can unleash unprecedented performance capabilities in data communication and sensing applications. Plasmonics were proposed as the key technology that can merge ultra-fast photonics and low-dimension electronics due to their metallic nature and their unique ability to guide light at sub-wavelength scales. However, inherent high losses of plasmonics in conjunction with the use of CMOS incompatible metals like gold and silver which are broadly utilized in plasmonic applications impede their broad utilization in Photonic Integrated Circuits (PICs). To overcome those limitations and fully exploit the profound benefits of plasmonics, they have to be developed along two technology directives. 1) Selectively co-integrate nanoscale plasmonics with low-loss photonics and 2) replace noble metals with alternative CMOS-compatible counterparts accelerating volume manufacturing of plasmo-photonic ICs. In this context, a hybrid plasmo-photonic structure utilizing the CMOS-compatible metals Aluminum (Al) and Copper (Cu) is proposed to efficiently transfer light between a low-loss Si3N4 photonic waveguide and a hybrid plasmonic slot waveguide. Specifically, a Si3N4 strip waveguide (photonic part) is located below a metallic slot (plasmonic part) forming a hybrid structure. This configuration, if properly designed, can support modes that exhibit quasi even or odd symmetry allowing power exchange between the two parts. According to 3D FDTD simulations, the proposed directional coupling scheme can achieve coupling efficiencies at 1550nm up to 60% and 74% in the case of Al and Cu respectively within a coupling length of just several microns.

A directional coupling scheme for efficient coupling between Si3N4 photonic and hybrid slot-based plasmonic waveguides

Slot-based plasmonic waveguides have attracted significant attention owing to their unique ability to confine light within nanometer-scale. In this context, enhanced localized light-matter interaction and control have been exploited to demonstrate novel concepts in data communication and sensing applications revealing the immense potential of plasmonic slot waveguides. However, inherent light absorption in the metallic parts included is such structures hampers the scaling of plasmonic devices and limits their application diversity. A promising solution of such issues is the use of hybrid plasmo-photonic configurations. Hybrid slot waveguides have been introduced as the means to reduce such propagation losses while maintaining their functional advantages. In addition, their co-integration with low-loss photonic waveguides can enable the development of more complex structures with acceptable overall losses. In such scenario, light needs to be efficiently transferred from the photonic to the plasmonic components and/or backwards. Based on this rationale, in this work a hybrid slot-based structure is adopted to achieve highly efficient light transfer between photonic and plasmonic slot waveguides in the near-infrared spectrum region (λ=1550 nm). This transition is realized with the aid of a directional coupling scheme. For this purpose, a Si3N4 bus waveguide (photonic branch) is located below an Aubased metallic slot (plasmonic branch) forming a hybrid waveguide element. The combined configuration, as it is shown with the aid of numerical simulations , is capable of supporting two hybrid guided modes with quasi-even and odd symmetry allowing the development of a power exchange mechanism between the two branches. In this context, a new directional coupling structure has been designed which can achieve power transmission per transition over 68% within a coupling length of the order of just several microns.

Butt-coupled interface between stoichiometric Si3N4 and thin-film plasmonic waveguides

Plasmonic technology has emerged as the most promising candidate to revolutionize future photonic-integrated-circuits (PICs) and deliver performance breakthroughs in diverse application areas by providing increased light-matter interaction at the nanometer scale, overcoming the diffraction limit. However, high insertion losses of plasmonic devices impede their practical deployment in PICs. To overcome this hurdle, selective integration of individual plasmonic devices on low-loss photonic platforms is considered, allowing for enhanced chip-scale functionalities with realistic power budgets. In this context, highly-efficient and fabrication-tolerant optical interfaces for co-planar plasmonic and photonic waveguides become essential, bridging these two “worlds” and ease combined high-volume manufacturing. Herein, a TM-mode butt-coupled interface for stoichiometric Si3N4 and Au-based thin-film plasmonic waveguides is proposed aiming to be utilized for bio-sensing applications. Following a systematic design process, this new configuration has been analyzed through 3D FDTD numerical simulations demonstrating coupling efficiencies up to 64% at the wavelength of 1.55 μm, with increased fabrication tolerance compared to silicon based waveguide alternatives.

Co-integrating plasmonics with Si3N4 photonics towards a generic CMOS compatible PIC platform for high-sensitivity multi-channel biosensors: the H2020 PlasmoFab approach (Conference Presentation)

Silicon photonics meet most fabrication requirements of standard CMOS process lines encompassing the photonics-electronics consolidation vision. Despite this remarkable progress, further miniaturization of PICs for common integration with electronics and for increasing PIC functional density is bounded by the inherent diffraction limit of light imposed by optical waveguides. Instead, Surface Plasmon Polariton (SPP) waveguides can guide light at sub-wavelength scales at the metal surface providing unique light-matter interaction properties, exploiting at the same time their metallic nature to naturally integrate with electronics in high-performance ASPICs. In this article, we demonstrate the main goals of the recently introduced H2020 project PlasmoFab towards addressing the ever increasing needs for low energy, small size and high performance mass manufactured PICs by developing a revolutionary yet CMOS-compatible fabrication platform for seamless co-integration of plasmonics with photonic and supporting electronic. We demonstrate recent advances on the hosting SiN photonic hosting platform reporting on low-loss passive SiN waveguide and Grating Coupler circuits for both the TM and TE polarization states. We also present experimental results of plasmonic gold thin-film and hybrid slot waveguide configurations that can allow for high-sensitivity sensing, providing also the ongoing activities towards replacing gold with Cu, Al or TiN metal in order to yield the same functionality over a CMOS metallic structure. Finally, the first experimental results on the co-integrated SiN+plasmonic platform are demonstrated, concluding to an initial theoretical performance analysis of the CMOS plasmo-photonic biosensor that has the potential to allow for sensitivities beyond 150000nm/RIU.