Doo Hyun Park

Semiconductor package and its manufacturing method

Substrate for semiconductor device and manufacturing method thereof

Wafer level fan out package

Fan-out semiconductor package

Semiconductor package with increased I/O density and method of making same

Substrate for semiconductor package and wire bonding method using thereof

Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers

Semiconductor device using emc wafer support system and fabricating method thereof

Semiconductor Package with Reduced Thickness

Semiconductor package having more reliable electrical conductive patterns