Doug A. A. Ohlberg
Hewlett-Packard
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Featured researches published by Doug A. A. Ohlberg.
international conference on electrical and control engineering | 2010
M. Saif Islam; Chad Johns; Long Do; Doug A. A. Ohlberg; Shih-Yuan Wang; R. Stanley Williams
The memristor is a fundamental circuit element (along with capacitor, resistor and inductor) whose conductance is dependent on the previous functioning history. The concept was postulated almost four decades ago and was actually fabricated only recently. We report the fabrication of memristive junctions using an insulating film of a monolayer of cadmium stearate deposited using the Langmuir-Blodgett method in the gap of an inert electrode and a chalcogenide solid electrolyte. The thickness of the organic monolayer is about 2.8nm and its presence helps ensure a constant gap size between the electrodes. We used an energetic plasma process to create the chalcogenide solid electrolyte using sulfur (S) containing plasma for converting thin films of copper (Cu) into a mix of covelite phase CuS and chalcocite phase Cu2S.
MRS Proceedings | 2006
Chad Johns; Ibrahim Kimukin; M. Saif Islam; Doug A. A. Ohlberg; Carrie L. Donley; Duncan Stewart; Shih-Yuan Wang; R. Stanley Williams
Characterization of molecular scale electronic devices generally involves deposition of a metal top electrode onto an organic film. During the evaporation process, high-energy granules of metals may lead to unwanted reactions between the organic molecules and deposited top electrodes. This can cause, as commonly reported, lasting damage which leaves most junctions either shorted or an open circuit. To overcome this important issue of physical damage to the molecules, we developed a novel technique of interfacing molecules by laying a prefabricated metallic electrode on top of a monolayer of molecules which were deposited onto another set of electrodes. A monolayer of cadmium stearate ((C17H35COO)2Cd) was deposited, using the Langmuir-Blodgett technique, onto platinum (Pt) electrodes which further rested on 200nm of oxide used for isolation. A separate set of aluminum with native oxide (Al/AlOx) electrodes were fabricated on a different oxide free, highly p-doped substrate and was gently placed on the cadmium stearate monolayer. Electrical connection to the top electrode was accomplished by probing the backside of the highly doped wafer whereas the bottom electrodes were individually addressed. Pressure was applied to ensure firm contact between the molecules and the top electrodes. Preliminary results showed an observed switching voltage of 3V-4V. Most of the devices with Al as the top electrodes exhibited a gradual progression from switching on the positive side, closing or no longer switching, and then switching towards the negative side.
Journal of Physical Chemistry B | 1999
Sehun Kim; G. Medeiros-Ribeiro; Doug A. A. Ohlberg; R. S. Williams; James R. Heath
Journal of Physical Chemistry B | 1998
R. S. Williams; G. Medeiros-Ribeiro; T. I. Kamins; Doug A. A. Ohlberg
Journal of Physical Chemistry B | 2004
Regina Ragan; Doug A. A. Ohlberg; Jason J. Blackstock; Sehun Kim; R. Stanley Williams
Archive | 2001
Duncan Stewart; Sam Kim; Yong Chen; Doug A. A. Ohlberg; R. Stanley Williams
Nanotechnology | 2010
Jianhua Yang; Feng Miao; Matthew D. Pickett; Doug A. A. Ohlberg; Duncan Stewart; Chun Ning Lau; R. Stanley Williams
한국진공학회 학술발표회초록집 | 2007
Sung-Soo Bae; Sehun Kim; Gilberto Medeiros-Rib; Jason J. Blackstock; Doug A. A. Ohlberg; Duncan Stewart; R. Stanley Williams; Sangyeob Lee; Regina Ragan
Archive | 2003
Duncan Stewart; Doug A. A. Ohlberg; Paul A. Beck; Chun Ning Lau; R. Stanley Williams
Archive | 1998
Doug A. A. Ohlberg; Gilberto Medeiros-Ribeiro; Theodore I. Kamins; R. Stanley Williams