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Dive into the research topics where Du Binh Nguyen is active.

Publication


Featured researches published by Du Binh Nguyen.


Archive | 1999

Method of forming copper interconnections with enhanced electromigration resistance and reduced defect sensitivity

Leon Ashley; Hormazdyar M. Dalal; Du Binh Nguyen; Hazara S. Rathore; Richard G. Smith


Archive | 2002

Method of making an edge seal for a semiconductor device

Birendra N. Agarwala; Hormazdyar M. Dalal; E. Liniger; Diana Llera-Hurlburt; Du Binh Nguyen; Richard W. Procter; Hazara S. Rathore; Chunyan E. Tian; Brett H. Engel


Archive | 1998

Copper interconnections with improved electromigration resistance and reduced defect sensitivity

Leon Ashley; Hormazdyar M. Dalal; Du Binh Nguyen; Hazara S. Rathore; Richard G. Smith; Alexander J. Swinton; Richard A. Wachnik


Archive | 2003

Edge seal for a semiconductor device

Birendra N. Agarwala; Hormazdyar M. Dalal; E. Liniger; Diana Llera-Hurlburt; Du Binh Nguyen; Richard W. Procter; Hazara S. Rathore; Chunyan E. Tian; Brett H. Engel


Archive | 1999

Copper interconnections with enhanced electromigration resistance and reduced defect sensitivity and method of forming same

Leon Ashley; Hormazdyar M. Dalal; Du Binh Nguyen; Hazara S. Rathore; Richard G. Smith


Archive | 1997

Self-aligned composite insulator with sub-half-micron multilevel high density electrical interconnections and process thereof

Hormazdyar M. Dalal; Du Binh Nguyen; Hazara S. Rathore


Archive | 1997

Sub-half-micron multi-level interconnection structure and process thereof

Hormazdyar M. Dalal; Du Binh Nguyen; Hazara S. Rathore


Archive | 2005

PROCESS FOR FORMING A REDUNDANT STRUCTURE

Birendra N. Agarwala; Du Binh Nguyen; Hazara S. Rathore


Archive | 1996

High temperature electromigration stress test system, test socket, and use thereof

Robert D. Edwards; Du Binh Nguyen; J. Poulin; Hazara S. Rathore; Richard G. Smith


Archive | 2007

DEVICE HAVING A REDUNDANT STRUCTURE

Birendra N. Agarwala; Du Binh Nguyen; Hazara S. Rathore

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